, Volume 68, Issue 11, pp 2737–2741 | Cite as

In situ Measurements of Irradiation-Induced Creep of Nanocrystalline Copper at Elevated Temperatures

  • Sezer Özerinç
  • Robert S. Averback
  • William P. King


We have measured irradiation-induced creep on nanocrystalline copper micropillars at elevated temperatures. The micropillars, which were ≈1 µm in diameter and ≈2 µm in height, were fabricated from magnetron-sputtered nanocrystalline copper films. The micropillars were compressed during 2.0 MeV Ar+ bombardment and the deformation measured in situ by laser interferometry. The creep rate was measured over the stress range 10–120 MPa at ≈200°C. The results show linear relationships of creep rate with both applied stress and displacement rate, yielding a creep compliance of 0.07 dpa−1 GPa−1 (dpa:displacement per atom). The findings are in good agreement with the previous results obtained using a bulge test on free-standing thin film specimens.


Creep Rate Creep Compliance Thermal Drift Bulge Test Nanocrystalline Copper 
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This research was supported by the U.S. Department of Energy, Office of Basic Energy Sciences, Division of Materials Sciences and Engineering under Award DEFG02-05ER46217. The work was carried out, in part, in the Frederick Seitz Materials Research Laboratory Central Facilities, University of Illinois.


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Copyright information

© The Minerals, Metals & Materials Society 2016

Authors and Affiliations

  1. 1.Department of Mechanical EngineeringMiddle East Technical UniversityAnkaraTurkey
  2. 2.Department of Materials Science and EngineeringUniversity of Illinois at Urbana-ChampaignUrbanaUSA
  3. 3.Department of Mechanical Science and EngineeringUniversity of Illinois at Urbana-ChampaignUrbanaUSA

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