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Tin whiskers: An illustrated guide to growth mechanisms and morphologies

  • Nanomaterials: Mechanical Behavior
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Abstract

This manuscript reports on the tin whiskers with a variety of different morphologies. The object of this work is to provide theorists with additional data upon which to build and test whisker growth theories. Many of these whiskers have non-standard morphology but are often observed and rarely reported. A number of potential growth mechanisms are discussed that are consistent with the growth morphology of individual whiskers. In addition whiskers with morphological features that are consistent with a screw dislocation growth mechanism are shown. This indicates that theories of whisker growth by dislocation should not be completely ruled out. Finally, whiskers in the vicinity of grain boundary sliding are presented. This left open questions of whether or not highly non-linear plastic deformation related mechanisms could be planning a significant role in whisker growth.

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References

  1. M. Warwick, J. Surface-Mount Technol., 12 (October 1000), pp. 14–19.

    Google Scholar 

  2. Y. Zang, CircuitTree (November 1999), pp. 28–33.

  3. G.T. Galyon, IEEE Trans. Electron. Packag. Manuf., 28 (2005), p. 94.

    Article  CAS  Google Scholar 

  4. P. Bush, G.L. Jones, and I. Boguslavasky, “Recrystallization Principles Applied to Whisker Growth in Tin,” (paper presented at the NEMI Workshop on Tin Whiskers, APEX 2003, Anaheim, CA, 1 April 2003).

  5. J.W. Osenbach, R.L. Shook, B.T. Vaccaro, B.D. Potteiger, A.N. Amin, K.N. Hooghan, S. Suratkar, and P. Ruengsinsub, IEEE Trans. Electron. Packag. Manuf., 28(1) (2005), pp. 36–62.

    Article  CAS  Google Scholar 

  6. W.J. Boettinger, C.E. Johnson, L.A. Bendersky, K.-W. Moon, N.E. Williams, and G.R. Stafford, Acta Mater., 53 (2005), p. 5033.

    Article  CAS  Google Scholar 

  7. J.S.M. Arnold, Plating, 53 (1966), p. 96.

    CAS  Google Scholar 

  8. C.A. Handwerker, “CALCE Symposium on Part Reprocessing, Tin Whisker Mitigation, and Assembly Rework/Repair” (12 November 2008).

  9. N. Asrar, O. Vancauwenberghe, and S. Prangere, J. Failure Analysis and Prevention 7 (2007), pp. 179–182.

  10. M.E. Williams, C.E. Johnson, K.-W. Moon, G.R. Stafford, C.A. Handwerker, and W.J. Boettinger, Proc. AESF SURF/FIN Conf. 2002 (2002), pp. 31–39

  11. T.H. Chuang, H.J. Lin, and C.C. Chi, Scripta Materails, 56 (2007), pp. 45–48.

    Article  CAS  Google Scholar 

  12. Henning Leidecker, Chris Greenwell, and Jay Brusse, “Whiskers of Tin-Lead (Sn-Pb) on Reflowed Die Attach Solder Used in the Manufacture of a Laser Diode Array” (NASA Goddard Space Flight Center, December 2003), nepp.nasa.gov/whisker/reference/tech_papers/Leidecker2003-SnPb-whiskers-onlaser-diode-array.pdf.

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  1. LSI Corporation, 1110 American Parkway NE, Allentown, PA, 18109, USA

    J. W. Osenbach

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  1. J. W. Osenbach
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Correspondence to J. W. Osenbach.

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Osenbach, J.W. Tin whiskers: An illustrated guide to growth mechanisms and morphologies. JOM 63, 57–60 (2011). https://doi.org/10.1007/s11837-011-0177-0

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  • DOI: https://doi.org/10.1007/s11837-011-0177-0

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