Abstract
A thermal plasma treatment was employed for economical recovery of valuable metals from e-waste. Cu-clad plates that simulated circuit boards were fed at the bottom of the reactor and treated with a plasma jet at temperatures between 385 and 840°C. Organic components of the Cu-clad plates were decomposed and contributed to the increased temperature of the offgas. Due to the low temperatures at the base of the reactor, the analyzed samples did not show losses characteristic for the plasma processes such as evaporation or metal oxidation. After plasma treatment, Cu foils were separated from the fiber glass and other solid residues allowing a complete recovery. Solid residues of the plates at the bottom of the reactor were crunched into small particles, allowing easy recycling or use as construction material.
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Mitrasinovic, A., Pershin, L., Wen, J.Z. et al. Recovery of Cu and valuable metals from E-waste using thermal plasma treatment. JOM 63, 24–28 (2011). https://doi.org/10.1007/s11837-011-0132-0
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DOI: https://doi.org/10.1007/s11837-011-0132-0