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Phase transformation and microstructural evolution in solder joints

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  • Phase Studies in Electronic Materials
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Abstract

Soldering is the most important of joining technologies and there are numerous solder joints in modern electronic products. The phases and microstructures of solder joints are critical to their properties. Various remarkable phenomena caused by phase transformation and microstructural evolution in solder joints have been reported. The phenomena include ripening, layer detachment, liquation, cruciform pattern formation, solid-state amorphization, alternating layer formation, shift of reaction paths, and the effects of electromigration.

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Authors and Affiliations

  1. Department of Chemical Engineering, National Tsing Hua University, 101 Section 2 Kuang Fu Road, Hsin-chu, Taiwan, 300, Taiwan

    Sinn-wen Chen, Chao-hong Wang, Shih-kang Lin, Chen-nan Chiu & Chih-chi Chen

Authors
  1. Sinn-wen Chen
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  2. Chao-hong Wang
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  3. Shih-kang Lin
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  4. Chen-nan Chiu
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  5. Chih-chi Chen
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Chen, Sw., Wang, Ch., Lin, Sk. et al. Phase transformation and microstructural evolution in solder joints. JOM 59, 39–43 (2007). https://doi.org/10.1007/s11837-007-0008-5

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