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The use of phase diagrams and thermodynamic databases for electronic materials

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Abstract

Phase diagrams and a thermodynamic database constructed by the Calculation of Phase Diagrams approach offer powerful tools for alloy design and materials development. This article presents recent progress on the thermodynamic database for microsolders and copper-based alloys, which is useful for the development of lead-free solders and prediction of interfacial phenomena between solders and the copper substrate in electronic packaging technology. In addition, examples of phase diagram applications are presented to facilitate the development of Co-Cr-based magnetic recording media in hard disks and new ferromagnetic shape-memory alloys.

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Authors and Affiliations

  1. the Department of Materials Science, Tohoku University, Japan

    X. J. Liu (associate professor), R. Kainuma (associate professor), I. Ohnuma (a research associate) & K. Ishida (a professor)

  2. the National Institute of Advanced Industrial Science and Technology, Sendai, Japan

    K. Oikawa (a senior researcher)

Authors
  1. X. J. Liu
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  2. R. Kainuma
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  3. I. Ohnuma
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  4. K. Ishida
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  5. K. Oikawa
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Additional information

For more information, contact K. Ishida, Tohoku University, Department of Materials Science, Graduate School of Engineering, Aoba-yama 02, Sendai 980-8579, Japan.

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Liu, X.J., Kainuma, R., Ohnuma, I. et al. The use of phase diagrams and thermodynamic databases for electronic materials. JOM 55, 53–59 (2003). https://doi.org/10.1007/s11837-003-0012-3

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  • DOI: https://doi.org/10.1007/s11837-003-0012-3

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