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Sintering microstructure and properties of copper powder prepared by electrolyzation and atomization

电解铜粉与雾化铜粉的烧结组织及性能

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Abstract

The almost completely dense copper was prepared by ultrafine copper powder prepared with both methods of electrolysis and novel water-gas atomization through cold isostatic pressing (CIP) and sintering under atmospheric hydrogen. Fine copper powder possesses the higher sintering driving force, thereby promoting shrinkage and densification during the sintering process. The grain size of sintered samples by electrolytic copper powder is smaller than that prepared by the atomized copper powder, and the twin crystals are particularly prone to forming in the former sintered microstructure due to the raw powder with low oxygen content and high residual stress originating from the CIP process. The relative density of samples by electrolytic and atomized powder at 1000 °C sintering temperature achieves 99.3% and 97.4%, respectively, significantly higher than that of the powder metallurgy copper parts reported in the literature. Correspondingly, the ultimate tensile strength and yield strength of samples by both kinds of copper powder are approximately similar, while the elongation of the sintered sample by the electrolytic powder (60%) is apparently higher than the atomized powder (44%). The superior performance of samples fabricated by electrolytic powder is inferred from the full density and low oxygen level for there is no cuprous oxide in the grain boundaries.

摘要

本文采用电解法和水气联合雾化法制备出超细铜粉,通过冷等静压、氢气烧结获得全致密铜。 细铜粉具有较高的烧结驱动力,促进烧结收缩和致密化。电解铜粉烧结样品的晶粒尺寸小于雾化铜粉, 且容易形成孪晶,这是由于电解铜粉氧含量低,冷等静压过程使粉末产生较高残余应力。在1000 °C 烧结温度下,电解铜粉和雾化铜粉烧结体的相对密度分别达到99.3%和97.4%,高于文献报道的粉末 冶金铜零件。两种粉末制备的烧结铜的抗拉强度和屈服强度接近,但电解铜粉烧结样品的延伸率(60%) 高于水气联合雾化铜粉的烧结样品(44%)。电解铜粉烧结样品的晶界中不含氧化亚铜,因此具有高的 密度和低的氧含量,最终获得优异的性能。

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Funding

Project(92066205) supported by the National Natural Science Foundation of China; Project(2019-Z10) supported by the State Key Lab for Advanced Metals and Materials of China; Project(FRF-MP-20-52) supported by the Fundamental Research Funds for the Central Universities, China

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Authors and Affiliations

  1. Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, China

    Pei Li  (李沛), Cun-guang Chen  (陈存广), Qian Qin  (秦乾), Tian-xing Lu  (陆天行), Yan-ru Shao  (邵艳茹), Fang Yang  (杨芳), Jun-jie Hao  (郝俊杰) & Zhi-meng Guo  (郭志猛)

  2. State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, China

    Cun-guang Chen  (陈存广)

  3. Innovation Group of Marine Engineering Materials and Corrosion Control, Southern Marine Science and Engineering Guangdong Laboratory (Zhuhai), Zhuhai, 519000, China

    Cun-guang Chen  (陈存广), Fang Yang  (杨芳) & Zhi-meng Guo  (郭志猛)

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  1. Pei Li  (李沛)
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Contributions

LI Pei and CHEN Cun-guang contributed equally to this work. CHEN Cun-guang and LI Pei conducted the literature review and wrote the draft of the manuscript. QIN Qian, LU Tian-xing and SHAO Yan-ru analyzed the measured data. YANG Fang and HAO Jun-jie edited the draft of manuscript. GUO Zhi-meng provided the concept. All authors replied to reviewers’ comments and revised the final version.

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Correspondence to Cun-guang Chen  (陈存广).

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LI Pei, CHEN Cun-guang, QIN Qian, LU Tianxing, SHAO Yan-ru, YANG Fang, HAO Jun-jie and GUO Zhi-meng declare that they have no conflict of interest.

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Li, P., Chen, Cg., Qin, Q. et al. Sintering microstructure and properties of copper powder prepared by electrolyzation and atomization. J. Cent. South Univ. 28, 1966–1977 (2021). https://doi.org/10.1007/s11771-021-4745-3

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