Abstract
The finite element method (FEM) and the boundary element method (BEM) are often adopted. However, they are not convenient to spatially vary thermal properties of functionally graded material (FGM). Therefore, the method of lines (MOL) is introduced to solve the temperature field of FGM. The basic idea of the method is to semi-discretize the governing equation into a system of ordinary differential equations (ODEs) defined on discrete lines by means of the finite difference method. The temperature field of FGM can be obtained by solving the ODEs. The functions of thermal properties are directly embodied in these equations and these properties are not discretized in the domain. Thus, difficulty of FEM and BEM is overcome by the method. As a numerical example, the temperature field of a plane problem is analyzed for FGMs through varying thermal conductivity coefficient by the MOL.
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References
Suresh S, Mortensen A. Fundamentals of Functionally Graded Materials [M]. London: IOM Communications Ltd, 1998.
Tanigawa Y, Akai T, Kawamura R, et al. Transient heat conduction and thermal stress problems of a non-homogeneous plate with temperature-dependent material properties [J]. Journal of Thermal Stresses, 1996, 19 (1): 77–102.
Jabbari M, Sohrabpour S, Eslami M R. Mechanical and thermal stresses in functionally graded hollow cylinder due to radially symmetric loads [J]. International Journal of Pressure Vessels and Piping, 2002, 79 (4): 493–497.
Obata Y, Noda N, Tsuji T. Steady thermal stresses in a functionally gradient material plate[J]. Trans JSME 1992, 58(12): 1689–1695.
Kim K S, Noda N. Green’s function approach to unsteady thermal stresses in an infinite hollow cylinder of functionally graded material [J]. Acta Mech, 2002, 156(2): 145–161.
Kim K S, Noda N. A green’s function approach to the deflection of a FGM plate under transient thermal loading[J]. Arch Appl Mech, 2002, 72(1): 127–137.
Jin Z H, Paulino G H. Transient thermal stress analysis of an edge crack in a functionally graded material [J]. Int J Fracture, 2001, 107(1): 73–98.
Shao Z S. Mechanical and thermal stresses of a functionally graded circular hollow cylinder with finite length [J]. International Journal of Pressure Vessels and Piping, 2005, 82(2): 155–163.
Fuchiyama T, Noda N. Analysis of thermal stress in a plate of functionally gradient material [J]. JSAE Rev, 1995, 16(2): 263–268.
WANG Bao-lin, ZHEN Hui-tian. Application of finite element-finite difference method to the determination of transient temperature field in functionally graded materials [J]. Finite Elements in Analysis and Design, 2005, 41(3): 335–349.
Praveen G N, Reddy J N. Nonlinear transient thermoelastic analysis of functionally graded ceramic-metal plates [J]. International Journal of Solids and Structures, 1998, 35(33): 4457–4476.
Shaw R P, Manolis G D. Two dimensional heat conduction in graded materials using conformal mapping [J]. Commun Numer Methods Engrg, 2003, 19(2): 215–221.
Sutradhar A, Paulino G H, Gray L J. Transient heat conduction in homogeneous and nonhomogeneous materials by the Laplace transform Galerkin boundary element method [J]. Engrg Anal Boundary Elem, 2002, 26(1): 119–132.
Matthew C W, Glaucio H P, Robert H, et al. Stress-intensity factors for surface cracks in functionally graded material under mode-I thermomechanical loading [J]. International Journal of Solids and Structures, 2003, 41(9): 1081–1118.
Ascher U, Christiansen J, Russell R D. Collocation software for boundary-value ODEs [J]. ACM Trans Mash Software, 1981, 7(2): 223–229.
KONG Xiang-qian. Application of the Finite Element Method to Heat Conduction Problems [M]. Beijing: Science Press, 1986. (in Chinese)
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Foundation item: Project (90305023 and 59731020) supported by the National Natural Science Foundation of China
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Dai, Y., Sun, Q., Hao, Gx. et al. Method of lines for temperature field of functionally graded materials. J Cent. South Univ. Technol. 12, 230–232 (2005). https://doi.org/10.1007/s11771-005-0047-4
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DOI: https://doi.org/10.1007/s11771-005-0047-4