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A novel compact his-EBG structure and its application in reduction of printed antenna mutual coupling

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Journal of Electronics (China)

Abstract

Anovel compact E shape High Impedance Surface (HIS) Electromagnetic Band-Gap (EBG) comprising Amended Minkowski Fractal Boundary (AMFB), Added Metal Strips (AMS), and metal plated via printed on a Rogers TMM 10i (ɛ r =9.8, t=2.0 mm) substrate is presented. The first order AMFB and ABS are introduced for equivalent capacitance enhancement and miniaturization with effective space-filling characteristics. The dimension of lattice size is only 0.058λ 0. The proposed structure exhibits a most compact characteristic about 35% size reduction as compared with conventional mushroom-like HIS-EBG, and better surface-wave decoupling of around 9 dB at the operating frequency band. Details of design parameters which affect the whole performance of certain band-gap are intensively investigated. A constructed prototype is potential candidate for antenna system performance enhancement.

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Authors and Affiliations

  1. Shanghai Engineering Center for Microsatellites, Chinese Academy of Sciences, Shanghai, 200050, China

    Yuan Lv, Xingwei Zhao, Huijie Liu & Xuemin Shen

  2. No. 2 Building, No. 865, Changning Road, Shanghai, 200050, China

    Yuan Lv

Authors
  1. Yuan Lv
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  2. Xingwei Zhao
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  3. Huijie Liu
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  4. Xuemin Shen
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Corresponding author

Correspondence to Yuan Lv.

Additional information

Supported by the 2010 Natural Science Foundation of Shanghai (No. 09ZR1430400).

Communication author: Lv Yuan, born in 1981, male, Ph.D., Assistant Researcher.

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Lv, Y., Zhao, X., Liu, H. et al. A novel compact his-EBG structure and its application in reduction of printed antenna mutual coupling. J. Electron.(China) 28, 161–168 (2011). https://doi.org/10.1007/s11767-011-0589-6

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  • DOI: https://doi.org/10.1007/s11767-011-0589-6

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