Skip to main content
Log in

A study on hot-carrier-induced gate oxide breakdown in partially depleted SIMOX MOSFET’s

  • Papers
  • Published:
Journal of Electronics (China)

Abstract

The hot-carrier-induced oxide regions in the front and back interfaces are systematically studied for partially depleted SOI MOSFET’s. The gate oxide properties are investigated for channel hot-carrier effects. The hot-carrier-induced device degradations are analyzed using stress experiments with three typical hot-carrier injection, i.e., the maximum gate current, maximum substrate current and parasitic bipolar transistor action. Experiments show that PMOSFET’s degradation is caused by hot carriers injected into the drain side of the gate oxide and the types of trapped hot carrier depend on the bias conditions, and NMOSFET’s degradation is caused by hot holes. This paper reports for the first time that the electric characteristics of NMOSFET’s and PMOSFET’s are significantly different after the gate oxide breakdown, and an extensive discussion of the experimental findings is provided.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. C. Hu, S. C. Tam, et al., Hot-carrier-induced MOSFET degradation-model, monitor and improvement, IEEE Trans. on Electron Devices, 32(1985)2, 375–385.

    Google Scholar 

  2. P. Heremans, R. Bellens, G. Groeseneken, et al., Consistent model for the hot-carrier degradation in n-channel and p-channel MOSFET’s, IEEE Trans. on Electron Devices, 45(1998)12, 2194–2209.

    Google Scholar 

  3. Y. Leblebici, S. Kang, Hot-Carrier Reliability of MOS VLSI Circuits, Boston, London, chapter 1.

  4. S. Tam, P. K. Ko, C. Hu, Lucky-election model of channel hot-electron injection in MOSFET’s, IEEE Trans. on Electron Devices, 31(1984)9, 1116–1125.

    Google Scholar 

  5. T. Tsuchiya, T. Ohno, Y. Kado, et al., Hot-carrier-injected oxide region in front and back interfaces in ultra-thin (50nm), fully depleted, deep-submicron NMOS and PMOSFET’s/SIMOX and their hot-carrier immunity, IEEE Trans. on on Electron Devices, 41(1994)12, 2351–2356.

    Article  Google Scholar 

  6. S. H. Renn, J. L. Pelloie, F. Balestra, Hot-carrier effects and reliable lifetime prediction in deep submicron N- and P-channel SOI MOSFET’s, IEEE Trans. on Electron Devices, 45(1998)11, 2335–2342.

    Article  Google Scholar 

  7. J. P. Colinge, Silicon-on-Insulator Tecnology Materials to VLSI, U.S.A, Kluwer Academic Pub., 1991.

    Google Scholar 

  8. J. G. Zhu, A study of SOI MOSFET’s perform and hot-carrier degradation, Master Dissertation, Xidian University, 2000, (in Chinese).

Download references

Author information

Authors and Affiliations

Authors

Additional information

Supported by the National Advance Research Foundation of China. (No.9825741)

About this article

Cite this article

Liu, H., Hao, Y. & Zhu, J. A study on hot-carrier-induced gate oxide breakdown in partially depleted SIMOX MOSFET’s. J. of Electron.(China) 19, 50–56 (2002). https://doi.org/10.1007/s11767-002-0008-0

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11767-002-0008-0

Key words

Navigation