Frontiers in Energy

, Volume 6, Issue 4, pp 311–340 | Cite as

Direct writing of electronics based on alloy and metal (DREAM) ink: A newly emerging area and its impact on energy, environment and health sciences

Feature Article


Electronics, such as printed circuit board (PCB), transistor, radio frequency identification (RFID), organic light emitting diode (OLED), solar cells, electronic display, lab on a chip (LOC), sensor, actuator, and transducer etc. are playing increasingly important roles in people’s daily life. Conventional fabrication strategy towards integrated circuit (IC), requesting at least six working steps, generally consumes too much energy, material and water, and is not environmentally friendly. During the etching process, a large amount of raw materials have to be abandoned. Besides, lithography and microfabrication are typically carried out in “Cleanroom” which restricts the location of IC fabrication and leads to high production costs. As an alternative, the newly emerging ink-jet printing electronics are gradually shaping modern electronic industry and its related areas, owing to the invention of a series of conductive inks composed of polymer matrix, conductive fillers, solvents and additives. Nevertheless, the currently available methods also encounter some technical troubles due to the low electroconductivity, complex sythesis and sintering process of the inks. As an alternative, a fundamentally different strategy was recently proposed by the authors’ lab towards truly direct writing of electronics through introduction of a new class of conductive inks made of low melting point liquid metal or its alloy. The method has been named as direct writing of electronics based on alloy and metal (DREAM) ink. A series of functional circuits, sensors, electronic elements and devices can thus be easily written on various either soft or rigid substrates in a moment. With more and more technical progresses and fundamental discoveries being kept made along this category, it was found that a new area enabled by the DREAM ink electronics is emerging, which would have tremendous impacts on future energy and environmental sciences. In order to promote the research and development along this direction, the present paper is dedicated to draft a comprehensive picture on the DREAM ink technology by summarizing its most basic features and principles. Some important low melting point metal ink candidates, especially the room temperature liquid metals such as gallium and its alloy, were collected, listed and analyzed. The merits and demerits between conventional printed electronics and the new direct writing methods were comparatively evaluated. Important scientific issues and technical strategies to modify the DREAM ink were suggested and potential application areas were proposed. Further, digestions on the impacts of the new technology among energy, health, and environmental sciences were presented. Meanwhile, some practical challenges, such as security, environment-friendly feature, steady usability, package, etc. were summarized. It is expected that the DREAM ink technology will initiate a series of unconventional applications in modern society, and even enter into peoples’ daily life in the near future.


direct writing of electronics based on alloy and metal (DREAM) ink direct writing of electronics printed electronics liquid metal ink integrated circuit consumer electronics nano liquid metal 


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  1. 1.
    Harrop P, Das R. Player and Opportunities 2012–2022. FRID Market Research Report. 2012Google Scholar
  2. 2.
    Sun Y G, Rogers J A. Inorganic semiconductors for flexible electronics. Advanced Materials, 2007, 19(15): 1897–1916CrossRefGoogle Scholar
  3. 3.
    Leenen M A M, Arning V, Thiem H, Steiger J, Anselmann R. Printable electronics: Flexibility for the future. Physical Status Solidi A, 2009, 206(4): 588–597CrossRefGoogle Scholar
  4. 4.
    Cui Z. Printed Electronics: Materials, Technologies and Applications. Beijing: Higher Education Press, 2012 (in Chinese)Google Scholar
  5. 5.
    Gao Y X, Li H Y, Liu J. Direct writing of flexible electronics through room temperature liquid metal ink. PLoS One, 2012, 7(9): e45485MathSciNetCrossRefGoogle Scholar
  6. 6.
    Li H Y, Yang Y, Liu J. Printable tiny thermocouple by liquid metal gallium and its matching metal. Applied Physics Letters, 2012, 101(7): 073511CrossRefGoogle Scholar
  7. 7.
    Liu J, Li H Y. A liquid metal based printed circuit board and its fabrication method. China Patent 201110140156. 6, 2011Google Scholar
  8. 8.
    Gao Y X, Li H Y, Liu J, Yan X M. Liquid metal ink enabled direct writing of functional circuits: A super-simple way for alternative electronics, 2012, in reviewGoogle Scholar
  9. 9.
    Liu J. Printable semiconductive device and its fabrication method. China Patent 2012103572802, 2012Google Scholar
  10. 10.
    Liu J, Li H Y. A thermal energy harvesting device and its fabrication method. China Patent 201210241718.0, 2012Google Scholar
  11. 11.
    Liu J. Piezoelectric thin film electricity generator and its fabrication method, China Patent 2012103225845, 2012Google Scholar
  12. 12.
    Liu J. Liquid metal ink printed microfluidic lab on paper and its fabrication method. China Patent 2012103625068, 2012Google Scholar
  13. 13.
    Liu J. Printable solar cell and its fabrication method. China Patent 2012103224715, 2012Google Scholar
  14. 14.
    Horikawa T, Mikami N, Makita T, Tanimura J, Kataoka M, Sato K, Nunoshita M. Dielectric properties of (Ba, Sr)TiO3 thin films deposited by RF sputtering. Journal of Applied Physics, 1993, 32(1): 4126–4130CrossRefGoogle Scholar
  15. 15.
    Sun X W, Kwok H S. Optical properties of epitaxially grown zinc oxide films on sapphire by pulsed laser deposition. Journal of Applied Physics, 1999, 86(1): 408–411CrossRefGoogle Scholar
  16. 16.
    Carcia P F, McLean R S, Reilly M H, Nunes G. Transparent ZnO thin-film transistor fabricated by RF magnetron sputtering. Applied Physics Letters, 2003, 82(7): 1117–1119CrossRefGoogle Scholar
  17. 17.
    Gross M, Linse N, Maksimenko L, Wellmann P J. Conductance enhancement mechanisms of printable nanoparticulate indium tin oxide (ITO) Layers for Application in Organic Electronic Devices. Advanced Engineering Materials, 2009, 11(4): 295–301CrossRefGoogle Scholar
  18. 18.
    Russo A, Ahn B Y, Adams J J, Duoss E B, Bernhard J T, Lewis J A. Pen-on-paper flexible electronics. Advanced Marerials, 2011, 23(30): 3426–3430CrossRefGoogle Scholar
  19. 19.
    Cho J H, Lee J, Xia Y, Kim B, He Y, Renn MJ, Lodge T P, Frisbie C D. Printable ion-gel gate dielectrics for low-voltage polymer thin-film transistors on plastic. Nature Materials, 2008, 7(11): 900–906CrossRefGoogle Scholar
  20. 20.
    Aernouts T, Vanlaeke P, Geens W, Poortmans J, Heremans P, Borghs S, Mertens R, Andriessen R, Leenders L. Printable anodes for flexible organic solar cell modules. Thin Solid Films, 2004, 451–452: 22–25CrossRefGoogle Scholar
  21. 21.
    Arias A C, Ready S E, Lujan R, Wong W S, Paul K E, Salleo A, Chabinyc M L, Apte R, Street R A, Wu Y, Liu P, Ong B. All jetprinted polymer thin-film transistor active-matrix backplanes. Applied Physics Letters, 2004, 85(15): 3304–3306CrossRefGoogle Scholar
  22. 22.
    Li B, Santhanam S, Schultz L, Jeffries-EL M, Iovu M C, Sauvé G, Cooper J, Zhang R, Revelli J C, Kusne A G, Snyder J L, Kowalewski T, Weiss L E, McCullough R D, Fedder G K, Lambeth D N. Inkjet printed chemical sensor array based on polythiophene conductive polymers. Sensors and Actuators B, Chemical, 2007, 123(2): 651–660CrossRefGoogle Scholar
  23. 23.
    Nur H M, Song J H, Evans J R G, Edirisinghe M J. Ink-jet printing of gold conductive tracks. Materials in Electronics, 2002, 13(4): 213–219CrossRefGoogle Scholar
  24. 24.
    Lee H H, Chou K S, Huang K C. Inkjet printing of nanosized silver colloids. Nanotechnology, 2005, 16(10): 2436–2441CrossRefGoogle Scholar
  25. 25.
    Woo K, Kim D, Kim J S, Lim S, Moon J. Ink-jet printing of Cu-Ag-based highly conductive tracks on a transparent substrate. Langmuir, 2009, 25(1): 429–433CrossRefGoogle Scholar
  26. 26.
    Smith P J, Shin D Y, Stringer J E, Derby B, Reis N. Direct ink-jet printing and low temperature conversion of conductive silver patterns. Journal of Materials Science, 2006, 41(13): 4153–4158CrossRefGoogle Scholar
  27. 27.
    Kim D, Jeong S, Park B K, Moon J. Direct writing of silver conductive patterns: Improvement of film morphology and conductance by controlling solvent compositions. Applied Physics Letters, 2006, 89(26): 264101CrossRefGoogle Scholar
  28. 28.
    Kim D, Moon J. Highly Conductive ink jet printed films of nanosilver particles for printable electronics. Electrochemical and Solid-State Letters, 2005, 8(11): 30–33CrossRefGoogle Scholar
  29. 29.
    Kim Y, Lee B, Yang S, Byun I, Jeong I, Cho S M. Use of copper ink for fabricating conductive electrodes and RFID antenna tags by screen printing. Current Applied Physics, 2012, 12(2): 473–478CrossRefGoogle Scholar
  30. 30.
    Tang X F, Yang Z G, Wang W J. A simple way of preparing highconcentration and high-purity nano copper colloid for conductive ink in inkjet printing technology. Colloid and Surfaces A. Physicochemical and Engineering Aspects, 2010, 360(1–3): 99–104CrossRefGoogle Scholar
  31. 31.
    Park B K, Kim D, Jeong S, Moon J, Kim J S. Direct writing of copper conductive patterns by ink-jet printing. Thin Solid Films, 2007, 515(19): 7706–7711CrossRefGoogle Scholar
  32. 32.
    Lee B, Kim Y, Yang S, Jeong I, Moon J. A low-cure-temperature copper nano ink for highly conductive printed electrodes. Current Applied Physics, 2009, 9(2): 157–160CrossRefGoogle Scholar
  33. 33.
    Kordás K, Mustonen T, Tóth G, Jantunen H, Lajunen M, Soldano C, Talapatra S, Kar S, Vajtai R, Ajayan P M. Inkjet printing of electrically conductive patterns of carbon nanotubes. Small, 2006, 2(8–9): 1021–1025CrossRefGoogle Scholar
  34. 34.
    Denneulin A, Bras J, Carcone F, Neuman C, Blayo A. Impact of ink formulation on carbon nanotube network organization within inkjet printed conductive films. Carbon, 2011, 49(8): 2603–2614CrossRefGoogle Scholar
  35. 35.
    Huang D, Liao F, Molesa S, Redinger D, Subramanian V. Plasticcompatible low resistance printable gold nanoparticle conductors for flexible electronics. Journal of the Electrochemical Society, 2003, 150(7): 412–417CrossRefGoogle Scholar
  36. 36.
    Kaempgen M, Chan C K, Ma J, Cui Y, Gruner G. Printable thin film supercapacitors using single-walled carbon nanotubes. Nano Letters, 2009, 9(5): 1872–1876CrossRefGoogle Scholar
  37. 37.
    Maksimenko I, Kilian D, Mehringer C, Voigt M, Peukert W, Wellmann P J. Fabrication, charge carrier transport, and application of printable nanocomposites based on indium tin oxide nanoparticles and conducting polymer 3,4-ethylenedioxythiophene/polystyrene sulfonic acid. Journal of Applied Physics, 2011, 110(10): 104301–104308CrossRefGoogle Scholar
  38. 38.
    Sekitani T, Nakajima H, Maeda H, Fukushima T, Aida T, Hata K, Someya T. Stretchable active-matrix organic light-emitting diode display using printable elastic conductors. Nature Materials, 2009, 8(6): 494–499CrossRefGoogle Scholar
  39. 39.
    Lee D H, Chang Y J, Herman G S, Chang C H. A general route to printable high-mobility transparent amorphous oxide semiconductors. Advanced Materials, 2007, 19(6): 843–847CrossRefGoogle Scholar
  40. 40.
    Fortuna S A, Wen J G, Chun I S, Li X. Planar GaAs nanowires on GaAs (100) substrates: Self-aligned, nearly twin-defect free, and transfer-printable. Nano Letters, 2008, 8(12): 4421–4427CrossRefGoogle Scholar
  41. 41.
    Panthani MG, Akhavan V, Goodfellow B, Schmidtke J P, Dunn L, Dodabalapur A, Barbara P F, Korgel B A. Synthesis of CulnS2, CulnSe2, and Cu(InxGa(1−x))Se2 (CIGS) nanocrystal “inks” for printable photovoltaics. Journal of the American Chemical Society, 2008, 130(49): 16770–16777CrossRefGoogle Scholar
  42. 42.
    Guillemles J F, Kronik L, Cahen D, Rau U, Jasenek A, Schock HW. Stability issues of Cu(In,Ga)Se2-based solar cells. Journal of Chemical Physics B, 2000, 104(20): 4849–4862CrossRefGoogle Scholar
  43. 43.
    Volkman S K, Mattis B A, Molesa S E, Lee J B, de la Fuente Vornbrock A, Bakhishev T, Subramanian V. A novel transparent air-stable printable n-type semiconductor technology using ZnO nanoparticles. In: IEEE International Electron Devices Meeting. Berkeley, USA, 2004, 769–772Google Scholar
  44. 44.
    Dasgupta S, Gottschalk S, Kruk R, Hahn H. A nanoparticulate indium tin oxide field-effect transistor with solid electrolyte gating. Nanotechnology, 2008, 19(43): 435203.1–435203.6CrossRefGoogle Scholar
  45. 45.
    Jeong J A, Kim H K. Characteristics of inkjet-printed nano indium tin oxide particles for transparent conducting electrodes. Current Applied Physics, 2010, 10(4): 105–108MathSciNetCrossRefGoogle Scholar
  46. 46.
    Gross M, Linse N, Maksimenko I, Wellmann P J. Conductance enhancement mechanisms of printable nanoparticulate indium tin oxide (ITO) layers for application in organic electronic devices. Advanced Engineering Materials, 2009, 11(4): 295–301CrossRefGoogle Scholar
  47. 47.
    Allen M L. Nanoparticle sintering methods and applications for printed electronics. Dissertation for the Doctoral Degree. Espoo, Finland: Aalto University, 2011Google Scholar
  48. 48.
    Siden J, Fein M K, Koptyug A, Nilsson H E. Printed antennas with variable conductive ink layer thickness. IET Microwaves, Antennas and Propagation, 2007, 1(2): 401–407CrossRefGoogle Scholar
  49. 49.
    Yan H, Chen Z H, Zheng Y, Newman C, Quinn J R, Dötz F, Kastler M, Facchetti A. A high-mobility electron-transporting polymer for printed transistors. Nature, 2009, 457(7230): 679–686CrossRefGoogle Scholar
  50. 50.
    Pudas M, Hagberg J, Leppävuori S. Gravure offset printing of polymer inks for conductors. Progress in Organic Coatings, 2004, 49(4): 324–335CrossRefGoogle Scholar
  51. 51.
    Shaheen S E, Radspinner R, Peyghambarian N, Jabbour G E. Fabrication of bulk heterojunction plastic solar cells by screen printing. Applied Physics Letters, 2001, 79(18): 2996–2998CrossRefGoogle Scholar
  52. 52.
    Pardo D A, Jabbour G E, Peyghambarian N. Application of screen printing in the fabrication of organic light-emitting devices. Advanced Materials, 2000, 12(17): 1249–1252CrossRefGoogle Scholar
  53. 53.
    Ito S, Chen P, Comte P, Nazeeruddin M K, Liska P, Péchy P, Grätzel M. Fabrication of screen-printing pastes from TiO2 powders for dye-sensitised solar cells. Progress in Photovoltaics: Research and Applications, 2007, 15(7): 603–612CrossRefGoogle Scholar
  54. 54.
    Bao Z N, Rogers J A, Katz H E. Printable organic and polymeric semiconducting materials and devices. Journal of Materials Chemistry, 1999, 9(9): 1895–1904CrossRefGoogle Scholar
  55. 55.
    Renn M J. Direct Write System. US7270844 B2. 2007Google Scholar
  56. 56.
    Martin G D, Hoath S D, Hutchings I M. Inkjet printing—The physics of manipulating liquid jets and drops. Journal of Physics: Conference Series, 2008, 105(1): 012001CrossRefGoogle Scholar
  57. 57.
    Mette A, Richter P L, Hörteis M, Glunz S W. Metal aerosol jet printing for solar cell metallization. Progress in Photovoltaics: Research and Applications, 2007, 15(7): 621–627CrossRefGoogle Scholar
  58. 58.
    Ahn B Y, Duoss E B, Motala M J, Guo X, Park S I, Xiong Y, Yoon J, Nuzzo R G, Rogers J A, Lewis J A. Omnidirectional printing of flexible, stretchable, and spanning silver microelectrodes. Science, 2009, 323(5921): 1590–1593CrossRefGoogle Scholar
  59. 59.
    Kahn B E. The M3D aerosol jet system, an alternative to inkjet printing for printed electronics. Organic and Printed Electronics, 2007, 1: 14–17Google Scholar
  60. 60.
    Hon K K B, Li L, Hutchings I M. Direct writing technology—Advances and developments. Manufacturing Technology, 2008, 57(2): 601–620Google Scholar
  61. 61.
    Perelaer J, De Laat A W M, Hendriks C E, Schubert U S. Inkjetprinted silver tracks: Low temperature curing and thermal stability investigation. Journal of Materials Chemistry, 2008, 18(27): 3209–3215CrossRefGoogle Scholar
  62. 62.
    Allen M L, Aronniemi M, Mattila T, Alastalo A, Ojanperä K, Suhonen M, Seppä H. Electrical sintering of nanoparticle structures. Nanotechnology, 2008,19(17): 175201.1–175201.4CrossRefGoogle Scholar
  63. 63.
    Ko S H, Pan H, Grigoropoulos C P, Luscombe C K, Fréchet J M J, Poulikakos D. All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles. Nanotechnology, 2007, 18(34), 345202.1–345202.8CrossRefGoogle Scholar
  64. 64.
    Perelaer J, de Gans B J, Schubert U S. Ink-jet printing and microwave sintering of conductive silver tracks. Advanced Materials, 2006, 18(16): 2101–2104CrossRefGoogle Scholar
  65. 65.
    Perelaer J, Klokkenburg M, Hendriks C E, Schubert U S. Microwave flash sintering of inkjet-printed silver tracks on polymer substrates. Advanced Materials, 2009, 21(47): 4830–4834CrossRefGoogle Scholar
  66. 66.
    Magdassi S, Grouchko M, Berezin O, Kamyshny A. Triggering the sintering of silver nanoparticles at room temperature. ACS Nano, 2010, 4(4): 1943–1948CrossRefGoogle Scholar
  67. 67.
    Wakuda D, Kim C J, Kim K S, Suganuma K. Room temperature sintering mechanism of Ag nanoparticle paste. In: Proceedings of the 2nd Electronics System-Integration Technology Conference. Greenwich, 2008, 909–914Google Scholar
  68. 68.
    Zapka W, Voil W, Loderer C, Lang P. Low temperature chemical post-treatment of inkjet printed nano-particle silver inks. In: International Conference on Digital Printing Technologies and Digital Fabrication. Pittsburgh: NIP24, 2008, 9: 906–911Google Scholar
  69. 69.
    Munir Z A, Anselmi-Tamburini U, Ohyanagi M. The effect of electric field and pressure on the synthesis and consolidation of materials: A review of the spark plasma sintering method. Journal of Materials Science, 2006, 41(3): 763–777CrossRefGoogle Scholar
  70. 70.
    Ko S H, Pan H, Grigoropoulos C P, Luscombe C K, Fréchet J M J, Poulikakos D. All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles. Nanotechnology, 2007, 18(34): 345202CrossRefGoogle Scholar
  71. 71.
    Thostenson E T, Chou TW. Microwave processing: Fundamentals and applications. Composites. Part A, Applied Science and Manufacturing, 1999, 30(9): 1055–1071CrossRefGoogle Scholar
  72. 72.
    Li H Y, Liu J. Revolutionizing heat transport enhancement with liquid metals: Proposal of a new industry of water-free heat exchangers. Frontiers in Energy, 2011, 5(1): 20–42CrossRefGoogle Scholar
  73. 73.
    Ma K Q, Liu J. Heat-driven liquid metal cooling device for the thermal management of a computer chip. Journal of Physics. D, Applied Physics, 2007, 40(15): 4722–4729CrossRefGoogle Scholar
  74. 74.
    Liu J, Zhou Y X, Lv Y G, Li T. Liquid metal based miniaturized chip-cooling device driven by electromagnetic pump. In: ASME 2005 International Mechanical Engineering Congress and Exposition. Orlando, USA, 2005: 501–510Google Scholar
  75. 75.
    Deng Y G, Liu J. Hybrid liquid metal-water cooling system for heat dissipation of high power density microdevices. Heat and Mass Transfer, 2010, 46(11–12): 1327–1334CrossRefGoogle Scholar
  76. 76.
    Deng Y G, Liu J. A liquid metal cooling system for the thermal management of high power LEDs. International Communications in Heat and Mass Transfer, 2010, 37(7): 788–791CrossRefGoogle Scholar
  77. 77.
    Liu J, Zhou Y X. A computer chip cooling method which uses low melting point metal and its alloys as the cooling fluid. China Patent02131419.5, 2002Google Scholar
  78. 78.
    Deng Z S, Liu J. Capacity evaluation of a MEMS based micro cooling device using liquid metal as coolant. In: The 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems. Zhuhai, China.2006, 1311–1315Google Scholar
  79. 79.
    Deng Y G, Liu J. Design of practical liquid metal cooling device for heat dissipation of high performance CPUs. ASME Journal of Electronic Packaging, 2010, 132(3): 031009CrossRefGoogle Scholar
  80. 80.
    Plevachuk Y, Sklyarchuk V, Yakymovych A, Svec P, Janickovic D, Illekova E. Electrical conductivity and viscosity of liquid Sn-Sb-Cu alloys. Journal of Materials Science Materials in Electronics, 2011, 22(6): 631–638CrossRefGoogle Scholar
  81. 81.
    Li P P, Liu J. Self-driven electronic cooling based on thermosyphon effect of room temperature liquid metal. ASME Journal of Electronic Packaging, 2011, 133(4): 041009CrossRefGoogle Scholar
  82. 82.
    Deng Y G, Liu J, Zhou Y X. Liquid metal based mini/micro channel cooling device. In: ASME 2009 7th International Conference on Nanochannels, Microchannels, and Minichannels June. Pohang, South Korea, 2009, 253–259Google Scholar
  83. 83.
    Jia D W, Liu J, Zhou Y. Harvesting human kinematical energy based on liquid metal magnetohydrodynamics. Physics Letters. [Part A], 2009, 373(15): 1305–1309Google Scholar
  84. 84.
    Dai D, Zhou Y X, Liu J. Liquid metal based thermoelectric generation system for waste heat recovery. Renewable Energy, 2011, 36(12): 3530–3536CrossRefGoogle Scholar
  85. 85.
    Li P P, Liu J. Harvesting low grade heat to generate electricity with thermosyphon effect of room temperature liquid metal. Applied Physics Letters, 2011, 99(9): 094106-1–094106-3CrossRefGoogle Scholar
  86. 86.
    Ge H S, Liu J. Phase change effect of low melting point metal for an automatic cooling of USB flash memory. Frontiers in Energy, 2012, 6(3): 207–209CrossRefGoogle Scholar
  87. 87.
    Islam R A, Chan Y C, Jillek W, Islam S. Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders. Microelectronics Journal, 2006, 37(8): 705–713CrossRefGoogle Scholar
  88. 88.
    Wang H, Xue S B, Chen W X, Zhao F. Effects of Ga-Ag, Ga-Al and Al-Ag additions on the wetting characteristics of Sn-9Zn-X-Y lead-free solders. Journal of Materials Science: Materials in Electronics, 2009, 20(12): 1239–1246CrossRefGoogle Scholar
  89. 89.
    Fu C C, Chen C C. Investigations of wetting properties of Ni-Vand Ni-Co alloys by Sn, Sn-Pb, Sn-Cu, and Sn-Ag-Cu solders. Journal of the Taiwan Institute of Chemical Engineers, 2011, 42(2): 350–355CrossRefGoogle Scholar
  90. 90.
    Zhao N, Pan XM, Yu D Q, Ma H T, Wang L. Viscosity and surface tension of liquid Sn-Cu lead-free solders. Journal of Electronic Materials, 2009, 38(6): 828–833CrossRefGoogle Scholar
  91. 91.
    Noor E E M, Sharif N M, Yewa C K, Ariga T, Ismail A B, Hussain Z. Wettability and strength of In-Bi-Sn lead-free solder alloy on copper substrate. Journal of Alloys and Compounds, 2010, 507(1): 290–296CrossRefGoogle Scholar
  92. 92.
    Zhang Y, Liang T X, Jusheng M A. Phase diagram calculation on Sn-Zn-Ga solders. Journal of Non-Crystalline Solids, 2004, 336(2): 153–156CrossRefGoogle Scholar
  93. 93.
    Ma K Q, Liu J, Xiang S H, Xie K W, Zhou Y X. Study of thawing behavior of liquid metal used as computer chip coolant. International Journal of Thermal Sciences, 2008, 48(5): 964–974CrossRefGoogle Scholar
  94. 94.
    Chentsov V P, Shevchenko V G, Mozgovoi A G, Pokrasin M A. Density and surface tension of heavy liquid metal coolants: Gallium and indium. Inorganic Materials: Applied Research, 2011, 2(5): 468–473CrossRefGoogle Scholar
  95. 95.
    Gao Y X, Liu J. Gallium-based thermal interface material with high compliance and wettability. Applied Physics: A, Materials Science & Processing, 2012, 107(3): 701–708CrossRefGoogle Scholar
  96. 96.
    Thostenson E T. The determination of the viscosity of liquid gallium over an extended range of temperature. Proceedings of the Physical Society, 1936, 48(2): 299–311CrossRefGoogle Scholar
  97. 97.
    Shalaby R M. Influence of indium addition on structure, mechanical, thermal and electrical properties of tin-antimony based metallic alloys quenched from melt. Journal of Alloys and Compounds, 2009, 480(2): 334–339CrossRefGoogle Scholar
  98. 98.
    Park H S, Cao L F, Dodbiba G, Fujita T. Preparation and properties of silica-coated ferromagnetic nano particles dispersed in a liquid gallium based magnetic fluid. In: The 11th International Conference on Electrorheological Fluids and Magnetorheological Suspensions. Dresden, Germany, 2008Google Scholar
  99. 99.
    Ito R, Dodbiba G, Fujita T. MR fluid of liquid gallium dispersing magnetic particles. International Journal of Modern Physics B, 2005, 19(7–9): 1430–1436CrossRefGoogle Scholar
  100. 100.
    Shi Y, Tian J, Hao H, Xia Z, Lei Y, Guo F. Effects of small amount addition of rare earth Er on microstructure and property of Sn-Ag-Cu solder. Journal of Alloys and Compounds, 2008, 453(1,2): 180–184CrossRefGoogle Scholar
  101. 101.
    Deng Y G, Liu J. Corrosion development between liquid gallium and four typical metal substrates used in chip cooling device. Applied Physics: A, Materials Science & Processing, 2009, 95(3): 907–915CrossRefGoogle Scholar
  102. 102.
    Lau J H, Wong C P, Lee N C, Lee R. Electronics Manufacturing: with Lead-Free, Halogen-Free and Conductive-Adhesive Materials. New York: McGraw Hill, 2002Google Scholar
  103. 103.
    Indium Corporation of America, Europe and Asia. Solder alloy chart., accessed on July, 2012
  104. 104.
    Hamadaa N, Uesugib T, Takigawab Y, Higashi K. Effects of Zn addition and aging treatment on tensile properties of Sn-Ag-Cu alloys. Journal of Alloys and Compounds, 2010, 527(25): 226–232Google Scholar
  105. 105.
    Laurila T, Vuorinen V, Paulasto-Kröckel M. Impurity and alloying effects on interfacial reaction layers in Pb-free soldering. Materials Science and Engineering: Reports, 2010, 68(1,2): 1–38CrossRefGoogle Scholar
  106. 106.
    Ahmed M, Fouzder T, Sharif A, Gain A K, Chan Y C. Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy. Microelectronics and Reliability, 2010, 50(8): 1134–1141CrossRefGoogle Scholar
  107. 107.
    Yusof M S, Gethin D T. Investigation of carbon black ink on fine solid line printing in flexography for electronic application. China Printing and Packing Study, 2011, 3(3): 74–76Google Scholar
  108. 108.
    Shin D Y, Jungb M, Chun S. Resistivity transition mechanism of silver salts in the next generation conductive ink for a roll-to-roll printed film with a silver network. Journal of Materials Chemistry, 2012, 22(23): 11755–11764CrossRefGoogle Scholar
  109. 109.
    Ma K Q, Liu J. Nano liquid-metal fluid as ultimate coolant. Physics Letters [Part A], 2007, 361(3): 252–256CrossRefGoogle Scholar
  110. 110.
    Argoitia A, Hayman C C, Angus J C, Wang L, Dyck J S, Kash K. Low pressure synthesis of bulk, polycrystalline gallium nitride. Applied Physics Letters, 1996, 70(2): 179–181CrossRefGoogle Scholar
  111. 111.
    Stevenson R. The world’s best gallium nitride., accessed on July, 2012
  112. 112.
    Zhang J J, Huang Y. Preparation and optical properties of AgGaS2 nanofilms. Crystal Research and Technology, 2011, 46(5): 501–506CrossRefGoogle Scholar
  113. 113.
    Moss S J, Ledwith A. The Chemistry of the Semiconductor Industry. New York: Chapman and Hall, 1987Google Scholar
  114. 114.
    Smart L, Moore E. Solid State Chemistry: An Introduction. 3rd ed. Boca Raton: Taylor and Francis CRC Press, 2005Google Scholar
  115. 115.
    Dong Y J, Peng Q, Wang R J, Li Y. Synthesis and characterization of an open framework ballium selenide: Ga4Se7(en)2·(enH)2. Inorganic Chemistry, 2003, 42(6): 1794–1796CrossRefGoogle Scholar
  116. 116.
    Creative Times. Can printed electronics save the music industry?, accessed on July, 2012
  117. 117.
    Kunnari E, Valkama J, Keskinen M, Mansikkamäki P. Environmental evaluation of new technology: Printed electronics case study. Journal of Cleaner Production, 2009, 17(9): 791–799CrossRefGoogle Scholar
  118. 118.
    Yang Y L, Chuang MC, Lou S L, Wang J. Thick-film textile-based amperometric sensors and biosensors Affiliation Information. Analyst (London), 2010, 135(6): 1230–1234CrossRefGoogle Scholar
  119. 119.
    Malzahn K, Windmiller J R, Valdés-Ramírez G, Schöning M J, Wang J. Wearable electrochemical sensors for in situ analysis in marine environments. Analyst (London), 2011, 136(14): 2912–2917CrossRefGoogle Scholar
  120. 120.
    California Institute for Telecommunications and Information Technology. Flexible, printable sensors detect underwater hazards., accessed on July, 2012
  121. 121.
    Wu C M L, Yu D Q, Law C M T, Wang L. Properties of lead-free solder alloys with rare earth element additions. Materials Science and Engineering: Reports, 2004, 44(1): 1–44CrossRefGoogle Scholar
  122. 122.
    Chen K I, Cheng S C, Wu S, Lin K L. Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy. Journal of Alloys and Compounds, 2006, 416(1–2): 98–105CrossRefGoogle Scholar
  123. 123.
    Hung F Y, Wang C J, Huang S M, Chen L H, Lui T S. Thermoelectric characteristics and tensile properties of Sn-9Zn-xAg lead-free solders. Journal of Alloys and Compounds, 2006, 420(1,2): 193–198CrossRefGoogle Scholar
  124. 124.
    El-Daly A A, Swilem Y, Hammad A E. Creep properties of Sn-Sb based lead-free solder alloys. Journal of Alloys and Compounds, 2009, 471(1–2): 98–104CrossRefGoogle Scholar
  125. 125.
    Zhang J S, Chan Y C, Wu Y P, Xi H J, Wu F S. Electromigration of Pb-free solder under a low level of current density. Journal of Alloys and Compounds, 2008, 458(1–2): 492–499CrossRefGoogle Scholar
  126. 126.
    Zhang Y, Liang T X, Jusheng M A. Phase diagram calculation on Sn-Zn-Ga solders. Journal of Non-Crystalline Solids, 2004, 336(2): 153–156CrossRefGoogle Scholar
  127. 127.
    Zhou J, Sun Y S, Xue F. Properties of low melting point Sn-Zn-Bi solders. Journal of Alloys and Compounds, 2005, 397(1–2): 260–264CrossRefGoogle Scholar
  128. 128.
    Chriašteľová J, Ožvold M. Properties of solders with low melting point. Journal of Alloys and Compounds, 2008, 457(1–2): 323–328CrossRefGoogle Scholar
  129. 129.
    Plevachuk Y, Sklyarchuk V, Yakymovych A, Svec P, Janickovic D, Illekova E. Electrical conductivity and viscosity of liquid Sn-Sb-Cu alloys. Journal of Materials Science Materials in Electronics, 2011, 22(6): 631–638CrossRefGoogle Scholar
  130. 130.
    Plevachuk Y, Sklyarchuk V, Hoyer W, Kaban I. Electrical conductivity, thermoelectric power and viscosity of liquid Snbased alloys. Journal of Materials Science, 2006, 41(14): 4632–4635CrossRefGoogle Scholar
  131. 131.
    Plevachuk Y, Mudry S, Sklyarchuk V, Yakymovych A, Klotz U E, Roth M. Viscosity and electrical conductivity of liquid Sn-Ti and Sn-Zr alloys. Journal of Materials Science, 2007, 42(20): 8618–8621CrossRefGoogle Scholar

Copyright information

© Higher Education Press and Springer-Verlag Berlin Heidelberg 2012

Authors and Affiliations

  1. 1.Key Laboratory of Cryogenics, Technical Institute of Physics and ChemistryChinese Academy of SciencesBeijingChina
  2. 2.Department of Biomedical Engineering, School of MedicineTsinghua UniversityBeijingChina

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