Abstract
The slotted fin concept was employed to improve the air cooling performance of plate-fin in heat sinks. Numerical simulations of laminar heat transfer and flow pressure drop were conducted for the integral plate fin, discrete plate fin and discrete slotted fin heat sinks. It is found that the performance of the discrete plate fin is better than that of the integral continuum plate fin and the performance of slotted fin is better than that of the discrete plate fin at the same pumping power of the fan. A new type of heat sink characterized by discrete and slotted fin surfaces with thinner fins and smaller spaces between fins is then proposed. Preliminary computation shows that this type of heat sink may be useful for the next generation of higher thermal load CPUs. The limit of cooling capacity for air-cooling techniques was also addressed.
Similar content being viewed by others
References
Octavio L, Gilbert D M, Erik D. Study of the optimal layout of cooling fins in forced convection cooling, Microelectronics Reliability, 2002, 42(7): 1101–1111
Ortega A. The evolution of air cooling in electronic systems and observations about its limits. In: Mishra S C, Prasad B V S S S, Garimella S V, eds. Proceedings of the 18th National & 7th ISHMT-ASME Heat and Mass Transfer Conference, New Delhi: Tata McGraw-Hill Publishing Company Limited, 2006, 119–133
Cheng Y P, Qu Z G, Tao W Q, et al. Numerical design of efficient slotted fin surface based on the field synergy principle, Numerical Heat Transfer: Part A, Applications, 2004, 45(6): 517–538
Tao W Q. Numerical Heat Transfer. Xi’an: Xi’an Jiaotong University Press, 2001 (in Chinese)
Author information
Authors and Affiliations
Corresponding author
Additional information
__________
Translated from Journal of Xi’an Jiaotong University, 2006, 40(11): 1241–1245 [译自: 西安交通大学学报]
Rights and permissions
About this article
Cite this article
Li, B., Tao, W. & He, Y. Study on forced air convection cooling for electronic assemblies. Front. Energy Power Eng. China 2, 158–163 (2008). https://doi.org/10.1007/s11708-008-0009-2
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11708-008-0009-2