Abstract
This study investigates the electrochemical stability of the gold complex based on mercaptotriazole at an optimum pH of nine in the electrolyte with a gold concentration of 2.5 g dm−3. The stability of the complex was studied by visual monitoring and electrochemical characterization of electrolytes over a period of 1 year. Electrochemical characterization of the mercaptotriazole gold complex was performed using open circuit potential measurement, cyclic voltammetry, recording the polarization curves, pH, and conductivity of the electrolyte. Electrochemical characteristics and visual appearance of the mercaptotriazole gold complex at a pH ~ 9 were not significantly changed for one year, with no changes in its visual appearance. The results of this study are important for industrial applications in order to replace cyanide electrolytes with a stable organic complex.
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References
Altinkaya P, Wang Z, Korolev I, Hamuyuni J, Haapalainen M, Kolehmainen E, Yliniemi K, Lundström M (2020) Leaching and recovery of gold from ore in cyanide-free glycine media. Miner Eng 158:106610. https://doi.org/10.1016/j.mineng.2020.106610
Baumgärtner ME, Raub ChJ, Gabe DR (1997) Assessment of surface cleanliness for metal surfaces using an electrochemical technique. Trans Inst Met Finish 75:101–107. https://doi.org/10.1080/00202967.1997.11871152
Das G, Mandal S (2015) Zwitterionic structures of selenocysteine-containing dipeptides and their interactions with Cu(II) ions. Chem Pap 69:616–626. https://doi.org/10.1515/chempap-2015-0064
Dauksher WJ, Resnick DJ, Johnson WA, Yanof AW (1994) A new operating regime for electroplating the gold absorber on x-ray masks. Microelectron Eng 23:235–238
De Sá AI, Eugénio S, Quaresma S, Rangel CM, Vilar R (2011) Electrodeposition of gold thin films from 1-butyl-1-methylpyrrolidinium dicyanamide Au3+ solutions. Thin Solid Films 519:6278–6283. https://doi.org/10.1016/j.tsf.2011.03.135
Dimitrijevic S, Rajcic-Vujasinovic M, Alagic S, Grekulovic V, Trujic V (2013) Formulation and characterization of electrolyte for decorative gold plating based on mercaptotriazole. Electrochim Acta 104:330–336. https://doi.org/10.1016/j.electacta.2013.04.123
Dimitrijević SB, Rajčić-Vujasinović M, Jančić-Hajneman RM et al (2014) Temperature effect on decorative gold coatings obtained from electrolyte based on mercaptotriazole-comparison with cyanide. Int J Mater Res 105:272–281. https://doi.org/10.3139/146.111017
Dimitrijević S, Stević Z, Rajčić-Vujasinović M, Grekulović V, Dimitrijević S, Trumić B, Alagić S (2015) The influence of novel organic gold complex on photoresist layer of printed circuit board. Metall Mater Eng 21:269–275
Dimitrijević SB, Rajčić-Vujasinović MM, Jančić-Hajneman RM, Bajat JB, Trujić VK, Trifunović DD (2016) Microhardness of decorative gold coatings obtained from gold complex based on mercaptotriazole: comparison with cyanide. Int J Mater Res 107:624–630. https://doi.org/10.3139/146.111382
Dimitrijević SB, Rajčić-Vujasinović M, Dimitrijević SP, Trumić B, Ivanović A (2018) Stability of gold complex based on mercaptotriazole in acid and neutral media. Bulg Chem Commun 50:50–57
Dimitrijević SB, Alagić SČ, Rajčić-Vujasinović MM, Dimitrijević SP, Ivanović AT (2019) IR/Raman characterization of Au-mercaptotriazole crystals. Bulg Chem Commun 51:358–364. https://doi.org/10.34049/bcc.51.3.5003
Dimitrijević SB, Dimitrijevic SP (2021). E-scrap processing: theory and practice, In: Gadow, Rainer and Mitic, Vojislav V. Advanced Ceramics and Applications, Walter de Gruyter GmbH, Berlin, Boston, pp 237–262. https://doi.org/10.1515/9783110627992
Đorđević S, Maksimović M, Pavlović M, Popov K (1998) Galvanotehnika. Tehnicka knjiga, Beograd, pp 87–110 (in Serbian)
Đorđević S (1990) Metalne prevlake. Tehnicka knjiga, Beograd, pp 295–298 (in Serbian)
Garcia JC, Burleigh TD (2013) The beginnings of gold electroplating. Electrochem Soc Interface 22:36–38. https://doi.org/10.1149/2.F02132if
Green TA (2007) Gold electrodeposition for microelectronic, optoelectronic and microsystem applications. Gold Bull 40:105–114. https://doi.org/10.1007/BF03215566
Green TA, Roy S (2006) Speciation analysis of Au(I) electroplating baths containing sulfite and thiosulfate. J Electrochem Soc 153:C157–C163. https://doi.org/10.1149/1.2164724/pdf
Hemsley SJ, Green RV (1991) The influence of bath components on deposit and operational characteristics in hard acid gold plating solutions. Trans IMF 69:149–153. https://doi.org/10.1080/00202967.1991.11870912
Holm SC, Straub BF (2011) Synthesis of N-substituted 1,2,4-triazoles. A review. Org Prep Proced Int 43:319–347. https://doi.org/10.1080/00304948.2011.593999
Honma H, Hagiwara K (1995) Fabrication of gold bumps using gold sulfite plating. J Electrochem Soc 142:81–85. https://doi.org/10.1149/1.2043948/pdf
Hosseini M, Ebrhimi S (2010) The effect of Tl(I) on the hard gold alloy electrodeposition of Au–Co from acid baths. J Electroanal Chem 645:109–114. https://doi.org/10.1016/j.jelechem.2010.04.013
Inoue T, Io S, Okudaira H, Ushio J, Tomizawa A, Takehara H, Shimazaki T, Yamamoto H, Yokono H (1999) In: Proceedings of the 45th IEEE electronic components technology conference, pp 1059–1067
Ji Ram V, Sethi A, Nath M, Pratap R (2019) Five-membered heterocycles. In: Ji Ram V, Sethi A, Nath M, Pratap R The chemistry of heterocycles, Elsevier, pp 149–478. https://doi.org/10.1016/B978-0-08-101033-4.00005-X
Jin L, Liu C, Yang FZ, Wu DY, Tian ZQ (2019) Coordination behavior of theophylline with Au(III) and electrochemical reduction of the complex. Electrochim Acta 304:168–174. https://doi.org/10.1016/j.electacta.2019.02.118
Kato M, Okinaka Y (2004) Some recent developments in non-cyanide gold plating for electronics applications. Gold Bull 37:37–44. https://doi.org/10.1007/BF03215515.pdf
Kato M, Sato J, Otani H, Homma T, Okinaka Y, Osaka T, Yoshioka O (2002) Substrate (Ni)-catalyzed electroless gold deposition from a noncyanide bath containing thiosulfate and sulfite: I reaction mechanism. J Electrochem Soc 149:C164–C167. https://doi.org/10.1149/1.1448502
Krulik GA, Mandich NV (1993) Metallic coatings. Kirk-Othmer encyclopedia of chemical technology, 4th edn. Wiley, NY, pp 258–291
Liew MJ, Roy S, Scott K (2003) Development of a non-toxic electrolyte for soft gold electrodeposition: an overview of work at University of Newcastle upon Tyne. Green Chem 5:376–381. https://doi.org/10.1039/B301176N
Luo G, Li D, Yuan G, Li N (2018) Communication-a cyanide-free electrolyte for hard gold (Au–Co) electrodepositing utilizing DMH as complexing agent. J Electrochem Soc 165:D107. https://doi.org/10.1149/2.0291803jes
Okinaka Y, Hoshino M (1998) Some recent topics in gold plating for electronics applications. Gold Bull 31:3–13. https://doi.org/10.1007/BF03215469
Osaka T, Okinaka Y, Sasano J, Kato M (2006) Development of new electrolytic and electroless gold plating processes for electronics applications. Sci Technol Adv Mater 7:425–437. https://doi.org/10.1016/j.stam.2006.05.003
Qu J, Huang SF, Zhou MJ, Li L, Li C, Geng HD (2014) The effects of additives on the properties of non-cyanide electroless gold plating deposition. Adv Mat Res 1030–1032:205–208
Rapson WS, Groenewald T (1978) Gold usage. Academic Press, London, pp 196–270
Remko M, Rode BM (2006) Effect of metal ions (Li+, Na+, K+, Mg2+, Ca2+, Ni2+, Cu2+, and Zn2+) and water coordination on the structure of glycine and zwitterionic glycine. J Phys Chem A 110:1960–1967. https://doi.org/10.1021/jp054119b
Richter F, Gesemann R, Gierth L, Hoyer E (1989). German Patent DD268484
Roy S (2009) Electrochemical gold deposition from non-toxic electrolytes. ECS Trans 16:67–72. https://doi.org/10.1149/1.3114009/pdf
Sato J, Kato M, Otani H, Homma T, Okinaka Y, Osaka T, Yoshioka O (2002) Substrate (Ni)-catalyzed electroless gold deposition from a noncyanide bath containing thiosulfate and sulfite: II. Deposit characteristics and substrate effects. J Electrochem Soc 149:C168. https://doi.org/10.1149/1.1448503
Sullivan A, Kohl P (1997) Electrochemical study of the gold thiosulfate reduction. J Electrochem Soc 144:1686–1690. https://doi.org/10.1149/1.1837660/pdf
Traut J, Wright J, Williams J (1990) Gold plating optimization for tape automated bonding. Plat Surf Finish 77:49–53
Wrzosek B, Bukowska J (2007) Molecular structure of 3-amino-5-mercapto-1, 2,4-triazole self-assembled monolayers on Ag and Au surfaces. J Phys Chem 111:17397. https://doi.org/10.1021/jp075442c
Xingkai Z, Qingyi Q, Li Q, Bin Z, Junyan Z (2020) Comparison study of gold coatings prepared by traditional and modified galvanic replacement deposition for corrosion prevention of copper. Microelectron Reliab 110:113695. https://doi.org/10.1016/j.microrel.2020.113695
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Ministry of Education, Science and Technological Development of the Republic of Serbia, contract numbers: 451-03-68/2022-14/200052; 451-03-68/2022-14/200135; 451-03-68/2022-14/200023; COST Action CA20130; India-Serbia Bilateral Scientific and Technological Cooperation: Recycling of valuable metals from discarded printed circuit boards.
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Dimitrijević, S.P., Dimitrijević, S.B., Ivanović, A. et al. Electrochemical stability of gold complex based on mercaptotriazole at optimal condition. Chem. Pap. 76, 7823–7832 (2022). https://doi.org/10.1007/s11696-022-02447-y
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DOI: https://doi.org/10.1007/s11696-022-02447-y