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Low-Temperature Interface Reaction Between Titanium and the Eutectic Silver-Copper Brazing Alloy

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Reaction zones formed at 790 °C between solid titanium and liquid Ag-Cu eutectic alloys (pure and Ti-saturated) have been characterized. When pure Ag-Cu eutectic alloy with 40 at.% Cu is used, the interface reaction layer sequence is: αTi/Ti2Cu/TiCu/Ti3Cu4/TiCu4/L. Because of the fast dissolution rate of Ti in the alloy, the reaction zone remains very thin (3-6 μm) whatever the reaction time. When the Ag-Cu eutectic alloy is saturated in titanium, dissolution no longer proceeds and a thicker reaction zone with a more complex layer sequence grows as the reaction time increases. Four elementary chemical interaction processes have been identified in addition to Ti dissolution in the liquid alloy. These are growth of reaction layers on Ti by solid state diffusion, nucleation and growth from the liquid of TiCu4, isothermal solidification of silver and, finally, chemical conversion of the Cu-Ti compounds by reaction-diffusion in the solid state. A mechanism combining these processes is proposed to account for the constitution of Ti/Ag-Cu/Ti joints brazed at 780-800 °C.

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  1. N. Eustathopoulos, M.G. Nicholas, B. Drevet (1999) Wettability at High Temperature. Pergamon, Amsterdam NL, 348-384

    Google Scholar 

  2. M. F. Wu, Z. S. Yu, C. Y. Jiang, C. Liang (2002) Growth Mechanism of Compounds at the Interface of Ti6Al4 V/Ag-28Cu Filler Alloy. Mater. Sci. Technol., 18, 1314-1316

    Article  Google Scholar 

  3. R.K. Shiue, S·K. Wu, C·H. Chan (2004) Interfacial Reactions of IR Brazing Cu and Ti. J. Alloys Compd., 372, 148-157

    Article  Google Scholar 

  4. C·C. Liu, C.L. Ou, R.K. Shiue (2002) The Microstructural Observation and Wettability Study of Brazing Ti-6Al-4 V and 304 Stainless Steel Using Three braze Alloys. J. Mater. Sci., 37, 2225-2235

    Article  Google Scholar 

  5. W.D. MacDonald, T.W. Eagar (1992) Transient liquid Phase Bonding. Annual Review of Materials Science, 22, 23-46

    Article  Google Scholar 

  6. W.D. MacDonald and T.W. Eagar, Low Temperature Transient Liquid Phase Bonding of Ti-6Al-4V, International Trends in Welding Science and Technology, Proceedings of the 3rd International Conference on Trends in Welding Research, Gattinburg (TN-USA), June 1-5 1992, S.A. David and J.M. Vitek eds., ASM Int., Metal Park, 1992, p 1083-1087

  7. J. Andrieux, O. Dezellus, F. Bosselet, M. Sacerdote-Peronnet, C. Sigala, R. Chiriac, J.C. Viala (2008) Details on the Formation of Ti2Cu3 in the Ag-Cu-Ti System in the Temperature Range 790 to 860 °C. J. Phase Equilibria and Diffusion, 29, 156-162

    Article  Google Scholar 

  8. V·N. Eremenko, Y.I. Buyanov, N.M. Panchenko (1970) The liquidus Surface of the System Ti-Cu-Ag. Porosh Metall., 88, 44-48

    Google Scholar 

  9. U.R. Kattner (2002) Phase Diagrams for Lead-free Solder Alloys, JOM, 54, 45-51

    Article  ADS  Google Scholar 

  10. M. Li, C. Li, F. Wang, W. Zhang (2005) Experimental Study and Thermodynamic Assessment of the Ag-Ti System. CALPHAD, 29, 269-275

    Article  ADS  Google Scholar 

  11. K·C.H. Kumar, I. Ansara, P. Wollants, L Delaey (1996) Thermodynamic Optimisation of the Cu-Ti System. Z. Metallkunde, 87, 666-672

    Google Scholar 

  12. R. Arroyave, “Thermodynamics and Kinetics of Ceramic/Metal Interfacial Interactions,” Phil Doc Thesis, MIT (USA), 2004

  13. O. Kubaschewski, Silver-Copper-Titanium, Ternary Alloys, Vol. 2, G. Petzow and G. Effenberg, Eds., VCH, Weinheim (G), 1988, p 55-59

  14. P. Villars, A. Prince, H. Okamoto (1995) Handbook of Ternary Alloy Phase Diagrams, ASM Int., Metals Park, 2353-2360

    Google Scholar 

  15. Ag-Cu-Ti (Silver-Copper-Titanium), Non-Ferrous Metal Ternary Systems. Selected Soldering and Brazing Systems: Phase Diagrams, Crystallographic and Thermodynamic Data, Landolt-Börnstein—Group IV Physical Chemistry, Vol. 11C3, Non-Ferrous Metal Systems, Part 3, Springer, Berlin, Heidelberg, 2007, p 63-74

  16. F.J.J. van Loo (1990) Multiphase Diffusion in Binary and Ternary Solid-State Systems. Progr. Solid State Chem., 20, 47-99

    Article  Google Scholar 

  17. H. Yokokawa (1999) Generalized Chemical Potential Diagram and Its Applications to Chemical Reactions at Interfaces between Dissimilar Materials. J. Phase Equilibria, 20, 258-287

    Article  Google Scholar 

  18. V·I. Dibkov, Growth Kinetics of Chemical Compound Layers, Cambridge Int. Sci. Pub, Cambridge (UK), 1998

    Google Scholar 

  19. G. Neumann, V. Tolle, C. Tuijn (2005) Application of the Modified Electrostatic Model to Diffusion of Transition Metals in Noble Metals. Physica B, 363, 7-18

    Article  ADS  Google Scholar 

  20. Y. L. Zou, T. L. Alford, Y. Zeng, F. Deng, S. S. Lau, T. Laursen, A. I. Amali, B. M. Ullrich (1997) Formation of Titanium Nitride by Annealing Ag/Ti Structures in Ammonia Ambient. J. Appl. Phys., 82, 3321-3327

    Article  ADS  Google Scholar 

  21. O. Dezellus, J. Andrieux, F. Bosselet, M. Sacerdote-Peronnet, T. Baffie, F. Hodaj, N. Eustathopoulos, and J.C. Viala, Transient Liquid Phase Bonding of Titanium to Aluminium Nitride, Mater. Sci. Eng. A, 2008. doi:10.1016/j.msea.2007.10.104

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Andrieux, J., Dezellus, O., Bosselet, F. et al. Low-Temperature Interface Reaction Between Titanium and the Eutectic Silver-Copper Brazing Alloy. J. Phase Equilib. Diffus. 30, 40–45 (2009).

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