Journal of Failure Analysis and Prevention

, Volume 18, Issue 6, pp 1652–1652 | Cite as

Retraction Note: Solder Selection for Reflowing Large Ceramic Substrates During PCB Assembly

  • Prashant Reddy GangidiEmail author
  • Noy Souriyasak
Retraction Note

Retraction Note to: J Fail. Anal. and Preven. (2017) 17:699–705

This article has been retracted by the corresponding author as he did not have permission to publish the data. The editor has been unable to contact Noy Souriyasak regarding this retraction. The scientific content has been removed for legal reasons.

Copyright information

© ASM International 2018

Authors and Affiliations

  1. 1.Quality and Reliability EngineeringFormFactor IncLivermoreUSA
  2. 2.Process EngineeringFormFactor IncLivermoreUSA

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