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Journal of Failure Analysis and Prevention

, Volume 10, Issue 6, pp 444–449 | Cite as

Microscopy Study of Tin Whiskers

  • Robert F. Champaign
  • Robert R. Ogden
Feature

Abstract

Tin whiskers are electrically conductive crystalline structures that may spontaneously grow from pure tin-plated surfaces. Since pure tin-plating is used as an electronic component lead finish, there is an inherent possibility that a short circuit may be formed between the component’s leads by tin whisker growth. The focus of this article is to share tin whisker observations that the authors have encountered over years of tin whisker research.

Keywords

Tin whiskers Microscopy Scanning electron microscope (SEM) Electron microscopy Failure analysis 

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Copyright information

© ASM International 2010

Authors and Affiliations

  1. 1.Raytheon Failure Analysis Lab, NCS DivisionMcKinneyUSA
  2. 2.Raytheon, Space and Airborne SystemsMcKinneyUSA

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