This case study details a tin pest failure that occurred on plated electrical connectors exposed to low temperatures during storage. Analysis indicated that the bismuth additives specified to combat tin pest were not present in sufficient quantities, and the degradation suffered by the connectors was confirmed as tin pest. New regulations (Restriction of Hazardous Substances Directive, ROHS) are limiting the use of common tin alloying elements that combat tin pest in electronic devices. The effects of this legislation with regard to tin pest are also discussed, indicating that frequency of failures from this phenomenon could increase.
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Eckert, A.: Organ pipes and tin pest. Mater. Corros. 59(3), 254–260 (2008)
Lasky, R.C.: Tin pest: a forgotten issue in lead free soldering. In: 2004 SMTA International Conference Proceedings, Chicago, IL, Sept 26–30, 2004, pp. 838–840
ROHS Directive—Directive 2002/95/EC
Plumbridge, W.: Recent observations on tin pest formation in solder alloys. J. Electron. Mater. 37(2), 218–223 (2008)
Plumbridge, W., Gagg, C., Williams, N., Kariya, Y.: Tin pest in Sn-05wt.% Cu lead-free solder. JOM 53(6), 39–41 (2001)
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Burns, N.D. A Tin Pest Failure. J Fail. Anal. and Preven. 9, 461–465 (2009). https://doi.org/10.1007/s11668-009-9280-8
- Tin pest
- Failure analysis