Agilent Speeds Up 3D X-ray Inspection of PCBAs
The Agilent Medalist x6000 AXI automated 3D X-ray inspection system for printed circuit board assembly (PCBA) reduces customers’ manufacturing conversion costs without compromising defect-detection capability. It accomplishes this by more than doubling the throughput of market-leading 3D solutions while using full 3D capability to find defects. The increased throughput of the Medalist x6000 has two clear benefits: First, it directly reduces the number of systems required to meet manufacturing volumes by cutting in half the required capital expenditures. Secondly, it enables complete 3D inspection of the entire PCBA at in-line speeds for the highest defect detection possible.
The Medalist x6000 can also reduce implementation barriers caused by high employee turnover in outsourced regions. This turnover rate can be a significant hindrance to developing high-quality applications, because effective programming knowledge-transfer is not...