Abstract
This paper reports on an investigation in which several standard Microelectromechanical Systems (MEMS) elements consisting of thermal actuators, inchworm drives, and comb drives were subjected to vibration loading representative of the environment seen in space applications. Finite-element analysis of the MEMS devices showed that sufficient margins existed under the expected environmental loading. Vibration testing, however, resulted in several failures in the devices, and analysis showed that progressive failure initiated from large local displacements. Debris transport and entrapment was another source of failure leading to shorting of thermal actuators. The results illustrate the importance of debris control and packaging design for reliable MEMS operation. Suggestions for improving the reliability of MEMS devices through practical layout and packaging guidelines are made.
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Petersen, K.: Silicon as a mechanical material. Proc. IEEE 70, 420–457 (1982).
Janson, S., Helvajian, H., Amimoto, S., Smit, G., Mayer, D., Feuerstein, S.: Microtechnology for space systems. In: Wright, R.P. (ed.) Proc. of the 1998 IEEE Aerospace Conference, 1, pp. 409–418. IEEE, Piscataway, NJ, USA (1998).
Benoit, J.: Micro and nanotechnologies: a challenge on the way forward to new markets. Mater. Sci. Eng.: B 51, 254–257 (1998).
Cass, S.: MEMS in space. IEEE Spectrum July 56–61 (2001).
George, T.: Overview of MEMS/NEMS technology development for space applications at NASA/JPL. In: Chiao, J.C. (ed.) Proc. on Smart Sensors, Actuators and MEMS, 5116, pp. 136–148. SPIE, Bellingham, WA, USA (2003) .
Rossi, C., Do Conto, T., Estève, D., Larangot, B.: Design, fabrication and modelling of MEMS-based microthrusters for space application. Smart Mater. Struct. 10, 1156–1162 (2001).
Brown, E.: RF-MEMS switches for reconfigurable integrated circuits. IEEE Trans. Microwave Theory Tech 46(11 pt.2), 1868–1880 (1998).
Miller, L.M.: MEMS for space applications. In: Courtois, B. (ed.) Proc. of the 1999 Design, Test, and Microfabrication of MEMS and MOEMS, 3680(1), pp. 2–11. SPIE, Bellingham, WA, USA (1999) .
Man, K.F.: MEMS reliability for space applications by elimination of potential failure modes through testing and analysis. In: Lawton, R.A. (ed.) Proc. on MEMS Reliability for Critical and Space Applications, 3880, pp. 120–129. SPIE, Bellingham, WA, USA (1999) .
Schmitt, P., Lafontan, X., Pressecq, F., Kurz, B., Oudea, C., Estève, D., Fourniols, J.Y., Camon, H.: Impact of space environmental conditions on the reliability of a MEMS COTS based system. Microelect. Reliab. 44, 1739–1744 (2004).
Shea, H.R.: Reliability of MEMS for space applications. In: Tanner, D.M. (ed.) Proc. on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V, 6111, pp. 61110A-1-10. SPIE, Bellingham, WA, USA (2006) .
Stark, J.P.W.: The space environment and its effects on spacecraft design. In: Fortescue, P., Stark, J. (eds.) Spacecraft Systems Engineering, pp. 9–32. Wiley, New York, USA (1991).
Muller, L., Hecht, M.H., Miller, L.M., Rockstad, H.K., Lyke, J.C.: Packaging and qualification of MEMS-based space systems. In: Proc. of the IEEE Micro Electro Mechanical Systems (MEMS) 1996, pp. 503–508. IEEE, Piscataway, NJ, USA (1996).
Knudson, A.R., Buchner, S., McDonald, P., Stapor, W.J., Campbell, A.B., Grabowski, K.S., Knies, D.L.: The effects of radiation on MEMS accelerometers. IEEE Trans. Nucl. Sci. 43(n.6 Pt 1), 3122–3126 (1996).
Lee, C.I., Johnston, A.H., Tang, W.C., Barnes, C.E., Lyke, J.: Total dose effects on microelectromechanical systems (MEMS): accelerometers. IEEE Trans. Nucl. Sci. 43(n.6 pt 1), 3127–3132 (1996).
Lyke, J., Forman, G.: Space electronic packaging research and engineering. In: Helvajian, H. (ed.) Microengineering Aerospace Systems, pp. 259–346. Aerospace Press, El Segundo, CA, USA (1999).
Koester, D.A., Mahadevan, R., Hardy, B., Markus, K.W.: MUMPS Design Handbook Revision 7, http://www.memsrus.com/ (2002).
Comtois, J.H., Michalicek, M., Barron, A., Craig, C.: Electrothermal actuators fabricated in four-level planarized surface micromachined polycrystalline silicon. Sensors Actuators A 70, 23–31 (1997).
Comtois, J.H., Bright, V.M.: Applications for surface-micromachined polysilicon thermal actuators and arrays. Sensors Actuators A 58, 19–25 (1997).
Sharpe, W.N. Jr., Yuan, B., Vaidyanathan, R., Edwards, R.L.: Measurement of Young’s modulus, Poisson’s ratio, and tensile strength of polysilicon. In: Proc of the Tenth IEEE Annual International Workshop on Micro Electro Mechanical Systems, pp. 42–429. IEEE, Piscataway, NJ, USA (1997).
Acknowledgments
The preceding work was performed under grant C00-213 of the California Space Authority’s Competitive Space Grant Program with close collaboration of Space Systems/Loral, Palo Alto, CA, USA). Assistance provided by Jun-Hyuk Choi and Matt Last of the Berkeley Composites Laboratory, Mechanical Engineering Department, University of California at Berkeley, Berkeley, CA, USA is gratefully acknowledged.
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Tan, T.F., Weber, K. & Dharan, C.K.H. Failure Analysis of Thermal Actuators, Comb Drives, and Other Microelectromechanical Elements. J Fail. Anal. and Preven. 7, 137–143 (2007). https://doi.org/10.1007/s11668-007-9018-4
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DOI: https://doi.org/10.1007/s11668-007-9018-4