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Suspension Flame Spray Construction of Polyimide-Copper Layers for Marine Antifouling Applications

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Abstract

Individual capsule-like polyimide splats have been fabricated by suspension flame spray, and the polyimide splat exhibits hollow structure with an inner pore and a tiny hole on its top surface. Enwrapping of 200-1000-nm copper particles inside the splats is accomplished during the deposition for constrained release of copper for antifouling performances. Antifouling testing of the coatings by 24-h exposure to Escherichia coli-containing artificial seawater shows that the Cu-doped splat already prohibits effectively attachment of the bacteria. The prohibited adhesion of bacteria obviously impedes formation and further development of bacterial biofilm. This capsulated splat with releasing and loading of copper biocides results in dual-functional structures bearing both release-killing and contact-killing mechanisms. The suspension flame spray route and the encapsulated structure of the polyimide-Cu coatings would open a new window for designing and constructing marine antifouling layers for long-term applications.

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Acknowledgements

This work was supported by National Natural Science Foundation of China (Grant # 31500772, 41476064 and 21705158) and Key Research and Development Program of Zhejiang Province (Grant # 2017C01003 and 2015C01036).

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Authors and Affiliations

  1. Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, China

    Yi Liu, Xiaomin Xu, Xinkun Suo, Yongfeng Gong & Hua Li

Authors
  1. Yi Liu
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  2. Xiaomin Xu
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  3. Xinkun Suo
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  4. Yongfeng Gong
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  5. Hua Li
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Correspondence to Hua Li.

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Liu, Y., Xu, X., Suo, X. et al. Suspension Flame Spray Construction of Polyimide-Copper Layers for Marine Antifouling Applications. J Therm Spray Tech 27, 98–105 (2018). https://doi.org/10.1007/s11666-017-0653-3

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  • DOI: https://doi.org/10.1007/s11666-017-0653-3

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