Abstract
In this present communication, an investigation was carried out to examine the influence of hexagonal boron nitride (h-BN) powder addition and its particle size on the density, microstructure, mechanical, thermal, and dielectric properties of h-BN containing β-SiAlON ceramic. It was observed that with the increase in BN content up to 5 wt.% in starting composition, the bulk density of β-SiAlON decreases drastically from 3.22 (for pristine SiAlON) to 3.05 g/cm3 and 2.90 g/cm3 for small and large particle size containing β-SiAlON, respectively. The bulk density and mechanical properties such as Young’s modulus, Vickers hardness, flexural strength, and fracture toughness of pristine β-SiAlON are superior in comparison with both types of β-SiAlON-BN ceramic. On the other side, the density and mechanical properties of β-SiAlON prepared with fine BN powder show superior value compared to that of larger BN particle-added β-SiAlON. The thermal properties such as thermal conductivity for both BN powder-added β-SiAlONs are higher compared to that of pristine β-SiAlON. However, larger BN particle-added β-SiAlON exhibits superior thermal conductivity than that of fine BN powder-added β-SiAlON. The dielectric constant of h-BN-added SiAlON is relatively lower than that of pristine β-SiAlON.
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Acknowledgments
The authors would like to thank Director-ARC International for his kind permission to publish this work. We express our gratitude to Dr. P.K. Jain (Scientist), Dr. Y.S. Rao (Scientist), and Dr. N. Ravi (Scientist) for extending their kind support to carry out the thermal property and flexural strength measurement, respectively. Our thanks also go to Mrs. B.V. Shalini (Technical Officer) and Mr. R. Anbarasu (Technical Officer) for their technical support during sample preparation.
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Barick, P., Saha, B.P. Effect of Boron Nitride Addition on Densification, Microstructure, Mechanical, Thermal, and Dielectric Properties of β-SiAlON Ceramic. J. of Materi Eng and Perform 30, 3603–3611 (2021). https://doi.org/10.1007/s11665-021-05692-6
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DOI: https://doi.org/10.1007/s11665-021-05692-6