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Study on Microstructure and Numerical Simulation of Tailored Hot Stamping Tools Refabricated by Surfacing Co-Based Alloy

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Abstract

Heated tailored hot stamping tool would suffer serious wear at high temperature after a period of use. An economical and efficient repair method is proposed to refabricate the failed tool. In this study, the physical properties and microstructure of the refabricated tool were revealed. 5CrNiMo substrate and Co-based surfacing layer could form excellent metallurgical bonding. Co-based surfacing layer exhibited higher hardness and high-temperature strength. Temperature field and stress field of 5CrNiMo homogenous tool and 5CrNiMo+Co-based tool for heated tailored tool were simulated, the results showed that the highest temperature and maximum stress always occurred at the time of t = 3s or t = 4s. The refabricated tool could better satisfy the high-temperature strength requirement than homogenous 5CrNiMo. At last, the feasibility of surfacing Co-based alloy on 5CrNiMo tool was verified, and B-pillar also was produced successfully by the refabricated tool.

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Acknowledgments

This work was financially supported by Chongqing Natural Science Foundation Postdoctoral Science Foundation in 2020 (Grant No. cstc2020jcyj-bshX0006), Chongqing technology Innovation and Application Development Special General Project (Grant No. cstc2019jszx-msxmX0030), and Graduate Scientific Research and Innovation Foundation of Chongqing, China (Grant No. CYB20004).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Chongqing University, Chongqing, 400044, China

    Shixin Peng, Jie Zhou, Qiuyun Wang, Mengmeng Zhang, Qian Shu & Fanjiao Gong-ye

  2. Chongqing Jiepin Technology Co.,Ltd., Chongqing, 400044, China

    Jiansheng Zhang & Shun Lu

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  1. Shixin Peng
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  2. Jie Zhou
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Correspondence to Jiansheng Zhang.

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Peng, S., Zhou, J., Wang, Q. et al. Study on Microstructure and Numerical Simulation of Tailored Hot Stamping Tools Refabricated by Surfacing Co-Based Alloy. J. of Materi Eng and Perform 30, 2732–2741 (2021). https://doi.org/10.1007/s11665-021-05602-w

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  • DOI: https://doi.org/10.1007/s11665-021-05602-w

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