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Cu-7Cr-0.1Ag Microcomposites Optimized for High Strength and High Condutivity

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Abstract

This paper (i) investigated how the microstructure, conductivity, and mechanical properties of Cu-7Cr-0.1Ag microcomposites were changed by cold drawing and subsequent heat treatment, and (ii) produced the Cu-7Cr-0.1Ag microcomposite with an optimum combination of strength and conductivity. The figure of merit Z (combining strength and conductivity) of the Cu-7Cr-0.1Ag microcomposite was larger than that of the microcomposite without silver for each heat treatment. The value of Z of the Cu-7Cr-0.1Ag microcomposite was a maximum after heat treatment for 1 h at 600 °C, indicating that this was the optimum intermediate heat treatment. The following combinations of conductivity, strength and ductility (measured as elongation to fracture) were obtained by the Cu-7Cr-0.1Ag microcomposite with η = 8: (i) 77.9% IACS (International Annealed Copper Standard), 920 MPa and 3.1%; (ii) 79.3% IACS, 880 MPa and 3.3%; and (iii) 79.9% IACS, 798 MPa and 3.5%. These values for the Cu-7Cr-0.1Ag microcomposite were larger than those of the Cu-7Cr microcomposite.

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Acknowledgments

We appreciate the financial support of the National Natural Science Foundation of China (51461018; 51561010), and the Science and Technology Program of Jiangxi Education Department (GJJ170976).

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Authors and Affiliations

  1. Jiangxi Key Laboratory of Precision Drive and Control, Nanchang Institute of Technology, Nanchang, 330029, China

    Keming Liu, Zhenxi Wang, Zhikai Huang, Xingwang Zhang & Quanguo Lu

  2. Faculty of Engineering and Information Sciences, University of Wollongong, Wollongong, NSW, 2522, Australia

    Zhengyi Jiang

  3. Division of Materials Engineering, The University of Queensland, Brisbane, QLD, 4072, Australia

    Andrej Atrens

  4. Institute of Applied Physics, Jiangxi Academy of Sciences, Nanchang, 330096, China

    Wei Guo, Jiuming Yu & Deping Lu

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  1. Keming Liu
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  2. Zhenxi Wang
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  3. Zhengyi Jiang
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  5. Zhikai Huang
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  6. Wei Guo
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  7. Xingwang Zhang
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  9. Quanguo Lu
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  10. Deping Lu
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Correspondence to Keming Liu.

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Liu, K., Wang, Z., Jiang, Z. et al. Cu-7Cr-0.1Ag Microcomposites Optimized for High Strength and High Condutivity. J. of Materi Eng and Perform 27, 933–938 (2018). https://doi.org/10.1007/s11665-018-3221-1

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  • DOI: https://doi.org/10.1007/s11665-018-3221-1

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