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Microstructure and Properties of Nanocrystalline Copper Strengthened by a Low Amount of Al2O3 Nanoparticles

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Abstract

Dispersion-strengthened Cu-Al2O3 materials have been studied over recent years to find an optimum processing route to obtain a high strength, thermal-stable copper alloy designed for modern applications in electrical engineering. The study analyses the influence of 1 vol.% of alumina content on strengthening the copper matrix. Microstructure of the Cu-Al2O3 composite was studied by x-ray diffraction as well as scanning and transmission electron microscopy. The composite shows a homogeneous, thermal-stable nanostructure up to 900 °C due to dispersed alumina nanoparticles. The particles effectively strengthen crystallite/grain boundaries in processes of powder consolidation and annealing of the compact. In contrast to monolithic Cu, the Cu-1 vol.% Al2O3 exhibits more than double strength and hardness. The nanocrystalline matrix and the low amount of alumina particles result in a yield strength of 288 MPa and a ductility of 15% which is a good combination for practical utilization of the material.

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Acknowledgment

This work was supported by the Scientific Grant Agency of the Ministry of Education, Science and Sport of the Slovak Republic and the Slovak Academy of Sciences (VEGA Project No. 2/0021/16).

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Authors and Affiliations

  1. Institute of Materials Research of Slovak Academy of Sciences, Watsonova 47, 040 01, Košice, Slovak Republic

    Katarína Ďurišinová, Juraj Ďurišin & Martin Ďurišin

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  1. Katarína Ďurišinová
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  2. Juraj Ďurišin
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  3. Martin Ďurišin
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Correspondence to Katarína Ďurišinová.

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Ďurišinová, K., Ďurišin, J. & Ďurišin, M. Microstructure and Properties of Nanocrystalline Copper Strengthened by a Low Amount of Al2O3 Nanoparticles. J. of Materi Eng and Perform 26, 1057–1061 (2017). https://doi.org/10.1007/s11665-017-2534-9

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  • DOI: https://doi.org/10.1007/s11665-017-2534-9

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