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Dissolution at Interfaces in Layered Solid-Liquid Thin Films: A Key Step in Joining Process

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Abstract

We have studied the dissolution process of Ni into liquid Al in Ni-Al multilayer nanofilms by means of molecular dynamics simulations. The elemental mechanisms underlying the dissolution process were described and found to be diffusion-limited. The subsequent evolution leading to intermetallic compound formation was analyzed and interpreted on the basis of classical nucleation theory. A better understanding of the microscopic behavior of Ni-Al reactive multilayer foils, which was essential for their use in joining applications, was obtained.

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Acknowledgment

The use of computational facilities at the Computing Center of the University of Bourgogne, PSIUN-CCUB, is gratefully acknowledged.

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Authors and Affiliations

  1. Laboratoire Interdisciplinaire Carnot de Bourgogne, UMR 6303 CNRS-Université Bourgogne Franche-Comté, Dijon, France

    F. Baras, V. Turlo & O. Politano

Authors
  1. F. Baras
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  2. V. Turlo
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  3. O. Politano
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Correspondence to F. Baras.

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Footnote: This article is an invited submission to JMEP selected from presentations at the Symposium “Interface Design and Modelling,” belonging to the Topic “Joining and Interfaces” at the European Congress and Exhibition on Advanced Materials and Processes (EUROMAT 2015), held September 20-24, 2015, in Warsaw, Poland, and has been expanded from the original presentation.

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Baras, F., Turlo, V. & Politano, O. Dissolution at Interfaces in Layered Solid-Liquid Thin Films: A Key Step in Joining Process. J. of Materi Eng and Perform 25, 3270–3274 (2016). https://doi.org/10.1007/s11665-016-1989-4

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  • DOI: https://doi.org/10.1007/s11665-016-1989-4

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