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Description of the Liquidus Surface and Characterization of Alloys of the Ternary Bi-Cu-In System

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Abstract

Lead-free solders with copper are considered as a possible substitution for standard lead-tin solders. Ternary Bi-Cu-In system is a potential soldering material based on copper. For a more complete characterization of the ternary Bi-Cu-In system, alloys from the three vertical sections were investigated using microstructural analysis as well as by electrical conductivity and Brinell hardness measurements. The microstructures of the alloys were investigated at room temperature by application of scanning electron microscopy combined with energy dispersive spectrometry and optical microscopy. Isolines of electrical conductivity and hardness for the entire Bi-Cu-In system were calculated using regression models. In addition, a thermodynamic assessment of the system has been carried out by calculation of the isothermal section at 25 °C and description of the liquidus surface using the CALPHAD method. Experimental and analytical results were found to be in a good agreement.

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Acknowledgments

This work was supported by the Ministry of Education and Science of the Republic of Serbia under Projects OI172037 and TR37020. Calculations were performed by Pandat 8.1 software.

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Authors and Affiliations

  1. Faculty of Technical Science, University in Priština, Kosovska Mitrovica, Serbia

    Duško Minić & Milena Premović

  2. Machinery Faculty, University in Kragujevac, Kraljevo, Serbia

    Milan Kolarević

  3. Institute of Chemistry, Technology and Metallurgy, University of Belgrade, Belgrade, Serbia

    Vladan Ćosović

  4. Technical Faculty, University of Belgrade, Bor, Serbia

    Dragan Manasijević & Dragana Živković

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  1. Duško Minić
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  2. Milena Premović
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  3. Milan Kolarević
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  4. Vladan Ćosović
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  5. Dragan Manasijević
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  6. Dragana Živković
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Correspondence to Duško Minić.

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Minić, D., Premović, M., Kolarević, M. et al. Description of the Liquidus Surface and Characterization of Alloys of the Ternary Bi-Cu-In System. J. of Materi Eng and Perform 22, 2343–2350 (2013). https://doi.org/10.1007/s11665-013-0493-3

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  • DOI: https://doi.org/10.1007/s11665-013-0493-3

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