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Simulation and Analysis of Residual Stress in the Graded Interlayer of MoSi2 Composite/316L Stainless Steel Joint

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Abstract

We reported the simulation and the analysis of the residual stress within the graded interlayered joints of MoSi2 to 316L stainless steel fabricated by spark plasma-sintering (SPS) technique. The residual stress in the joints was analyzed by the finite element ANSYS code. The results show that the maximum radial and axial residual tension stresses first decrease and then increase with the increase of the compositional distribution exponent (P), and consistently decrease with the increase of the number (n) and the thickness (d) of graded layer, respectively. The optimal values of compositional distribution exponent, the thickness, and the number of graded interlayered joints of the MoSi2 composite/316L are P = 0.8, d = 1.0 mm, and n = 9, respectively. The residual tension stresses in the samples treated by nine graded interlayers are reduced to 24% and 25% of those in the joints without the interlayer, respectively.

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Authors and Affiliations

  1. Institute of Material Science & Engineering, East China University of Science and Technology, Shanghai, 200237, China

    Jinfu Xu, Haifei Wu & Yifu Ye

  2. Research Institute of Material and Technology, Ningbo University of Technology, Ningbo, 315016, China

    Jinfu Xu

  3. Institute of Material Science & Engineering, China University of Mining and Technology, Xuzhou, 221008, China

    Xuebin Zhang & Youjin Fei

  4. Key Laboratory of Low Dimensional Materials and Application Technology (Ministry of Education), Faculty of Materials and Optoelectronic Physics, Xiangtan University, Xiangtan, Hunan, 411105, China

    Wen Li

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  1. Jinfu Xu
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  2. Haifei Wu
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  3. Xuebin Zhang
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  4. Youjin Fei
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  5. Yifu Ye
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  6. Wen Li
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Correspondence to Wen Li.

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Xu, J., Wu, H., Zhang, X. et al. Simulation and Analysis of Residual Stress in the Graded Interlayer of MoSi2 Composite/316L Stainless Steel Joint. J. of Materi Eng and Perform 17, 802–807 (2008). https://doi.org/10.1007/s11665-008-9226-4

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  • DOI: https://doi.org/10.1007/s11665-008-9226-4

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