Skip to main content
SpringerLink
Log in

Forming solder joints by sintering eutectic tin-lead solder paste

  • Regular Issue Paper
  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

It is possible to form solder joints with mechanical integrity, but not mechanical strength comparable to that achieved by melting the solder, by sintering eutectic tin-lead solder paste where small amounts of eutectic Sn-Bi powder are added to the paste. This increases the rate of sintering through liquid-phase sintering.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. D. Napp, “High Temperature Fatigue Resistant Solder—A NCMS Project” (Paper presented at the 1997 TMS Annual Meeting, Orlando, Florida, 9–13 February 1997).

  2. The Lead-free Solder Project: Final Report (City: National Center for Manufacturing Sciences, 1997).

  3. R.M. German, Powder Metallurgy Science, 2nd Edition (Princeton, NJ: Metal Powder Industries Federation, 1994).

    Google Scholar 

  4. W.D. Kingery, H.K. Bowen, and D.R. Uhlmann, Introduction to Ceramics, 2nd Edition (New York: Wiley, 1976).

    Google Scholar 

  5. D. Verhoven, Fundamentals of Physical Metallurgy (New York: Wiley, 1975), p. 517.

    Google Scholar 

Download references

Author information

Author notes

  1. Mark A. Palmer (Assistant Professor)

    Present address: Mechanical Engineering, Virginia Commonwealth University, Richmond, VA

  2. Brian Nguyen (Design Engineer)

    Present address: General Electric Company, USA

Authors and Affiliations

  1. Center for Integrated Electronics, Electronic Manufacturing, and Electronic Media; and Materials Science and Engineering Department, Rensselaer Polytechnic Institute, 12180, Troy, NY

    Mark A. Palmer (Assistant Professor), Christy N. Alexander & Brian Nguyen (Design Engineer)

Authors
  1. Mark A. Palmer
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Christy N. Alexander
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Brian Nguyen
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Palmer, M.A., Alexander, C.N. & Nguyen, B. Forming solder joints by sintering eutectic tin-lead solder paste. J. Electron. Mater. 28, 912–915 (1999). https://doi.org/10.1007/s11664-999-0219-3

Download citation

  • Received:

  • Accepted:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-999-0219-3

Key words

Search

Navigation