Abstract
A study on the techniques to yield wafer emissivity independent temperature measurements in rapid thermal processing has been presented. This study focuses on the Steag-AST Electronik approach to enhance wafer emissivity by using the Hotliner*. The Hotliner comprises of a heavily doped p-Si substrate sandwiched with Si3N4/SiO2 from both sides. Experimental measurements on the optical properties of the Hotliner using a spectral emissometer operating in the wavelength range of 1–20 µm are presented here. Results of the simulation of the experimental data using the MIT/SEMATECH Multi-Rad model are discussed.
Similar content being viewed by others
References
P.J. Timans, Advances in Rapid Thermal and Integrated Processing, ed. F. Roozeboom, (Dordrecht, The Netherlands: Kluwer Academic Publishers, 1996), chap. 2, p. 35.
K. Sato, Jpn. J. Appl. Phys. 6 (3), 339 (1967).
P. Vandenabeele and K. Maex, J. Appl. Phys. 72, 5867 (1992).
S. Abedrabbo, J.C. Hensel, O.H. Gokce, F.M. Tong, B. Sopori, A.T. Fiory and N.M. Ravindra, Mater. Res. Soc. Proc., Spring (Pittsburgh, PA: Mater. Res. Soc., 1998), in press.
F. Roozeboom, Advances in Rapid Thermal and Integrated Processing, ed. F. Roozeboom, (Dordrecht, The Netherlands: Kluwer Academic Publishers, 1995), chap. 1, p. 1.
N.M. Ravindra., F.M. Tong, W. Schmidt, W. Chen, S. Abedrabbo, A. Nanda, T. Speranza and A.M. Tello, ISSM ’96, Proc. Fifth Intl. Symp. on Semiconductor Manufacturing, Tokyo, Japan, October, (1996), p. 101.
J.R. Markham et al., Review Scientific Instruments 64 (9), 2515 (1993).
M. Born and E. Wolf, Principles of Optics, Fourth Ed., (Pergamon Press, 1970), chap. 8, p. 381.
K.D. Moeller, Optics, in press, chap. 5.
F. Roozeboom, Rapid Thermal Processing Science and Technology, ed. R.B. Fair, (New York: Academic Press, Inc., 1993), p. 349.
J.M. Palmer, Handbook of Optics, Vol. II, ed. M. Bass, (1995), chap. 25, p. 8.
N.M. Ravindra, S. Abedrabbo, W. Chen, F.M. Tong, A.K. Nanda and T. Speranza, IEEE Trans. on Semiconductor Manu. 11 (1), 30 (1998).
R.A. Smith, Semiconductors, (Cambridge, England: Cambridge University Press, Cambridge, 1961), p. 216.
D.K. Schroder, R. Noel Thomas and J.C. Swartz, IEEE J. Solid-State Circuits SC-13, (1), Feb. (1978).
S. Abedrabbo, Ph.D. Dissertation, New Jersey Institute of Technology, August (1998).
S. Abedrabbo, J.C. Hensel, A.T. Fiory, B. Sopori, W. Chen and N.M. Ravindra, Materials Science in Semiconductor Processing, (in press).
H.F. Wolf, Semiconductors, (New York: John Wiley & Sons, 1971), p. 59.
T.J. Riley, R. Bremensdorfer and S. Marcus, Proc. MRS ’97, April, (Pittsburgh, PA: Mater. Res. Soc., 1997), p. 35.
N. M. Ravindra et al., Fourth Intl. Conf. on Rapid Thermal Processing, Boise, Idaho, September, (1996), p. 190.
S. Abedrabbo, N.M. Ravindra, W. Chen, V. Rajasekhar, T. Golota, O.H. Gokce, A.T. Fiory, B. Nguyenphu, A. Nanda, T. Speranza, W. Maszara and G. Williamson, Proc. Materials Research Society, April (Pittsburgh, PA: Mater. Res. Soc., 1997).
P.J. Timans, Solid State Technol. 40 (4), 63 (1997).
Z. Atzmon, Z. Doitel, A. Harnik, S. Levi, A. Thon, P. Alezra and H. Gilboa, Fifth Intl. Conf. on Rapid Thermal Processing, Louisiana, New Orleans, September, (1997), p. 114.
Author information
Authors and Affiliations
Additional information
Hotliner is a trademark of Steag-AST Electronik, patent pending.
Rights and permissions
About this article
Cite this article
Abedrabbo, S., Tong, F.M., Ravindra, N.M. et al. Wafer emissivity independent temperature measurements. J. Electron. Mater. 27, 1323–1328 (1998). https://doi.org/10.1007/s11664-998-0091-6
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/s11664-998-0091-6