Skip to main content
SpringerLink
Log in

Interfacial sliding in Cu/Ta/polyimide high density interconnects as a result of thermal cycling

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

A scanning probe microscope was used to observe thermally induced deformation of 1 μm thick Cu/Ta/polyimide test structures on Si. Relative height changes in arrays of parallel Cu and polyimide lines of various aspect ratios were examined in air at room temperature before and after a 25-350-25°C thermal cycle conducted in gettered nitrogen. Grain elevation and hillock formation at grain boundaries were observed on the Cu surface as a result of the thermal cycling. It was also observed that significant sliding occurs at the Cu/Ta interface with 1 μm wide Cu lines. Less or no sliding was observed at the interface with 10 μm wide Cu lines.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. J.M.E. Harper, E.G. Colgan, C.-K. Hu, J.P. Hummel, L.P. Buchwalter and C.E. Uzoh, MRS Bulletin XIX (8), 23 (1994).

    Google Scholar 

  2. C.K. Hu, B. Luther, F.B. Kaufman, J. Hummel et al., Thin Solid Films 262 (1–2), 84 (1995).

    Article  CAS  Google Scholar 

  3. D.Y. Yoon, W. Parrish, L.E. Depero and M. Ree, Mater. Res. Soc. Symp. Proc. 227, (Pittsburgh, PA: Mater. Res. Soc, 1991), p. 387.

    Google Scholar 

  4. S. Numata and N. Kinjo, Poly. Eng. and Sci. 28, 906 (1988).

    Article  CAS  Google Scholar 

  5. M. Ree, K.-J. Chen, D.P. Kirby, N. Katzenellenbogen and D. Grischkowsky, J. Appl. Phys. 72 (5), 2014 (1992).

    Article  CAS  Google Scholar 

  6. L. Lin and S.A. Bidstrup, J. Appl. Polym. Sci. 54,553 (1994).

    Article  CAS  Google Scholar 

  7. D.V. Zhmurkin, T.S. Gross, L.P. Buchwalter and F.B. Kaufman, J. Electron. Mater. 25 (6), 976 (1996).

    CAS  Google Scholar 

  8. J.E. Sanchez, Jr., Mater. Res. Symp. Proc. 343, (Pittsburgh, PA: Mater. Res. Soc, 1994), p. 641.

    Google Scholar 

  9. P.R. Besser, J.E. Schez, Jr., S. Brennan, J.C. Bravman, G. Takaoka and I. Yamada, Mater. Res. Symp. Proc. 343, (Pittsburgh, PA: Mater. Res. Soc, 1994), p. 659.

    Google Scholar 

  10. R.A. Schwarzer and D. Gerth, J. Electron. Mater. 22 (6), 607 (1993).

    CAS  Google Scholar 

  11. R. Raj and M.F. Ashby, Metal. Trans. 2 (4), 1113 (1971).

    Google Scholar 

  12. R. Raj, personal communication.

Download references

Author information

Authors and Affiliations

  1. Department of Mechanical Engineering, University of New Hampshire, 03824, Durham, NH

    D. V. Zhmurkin & T. S. Gross

  2. IBM-Thomas J. Watson Research Laboratory, 10598, Yorktown Heights, NY

    L. P. Buchwalter

Authors
  1. D. V. Zhmurkin
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. T. S. Gross
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. L. P. Buchwalter
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Zhmurkin, D.V., Gross, T.S. & Buchwalter, L.P. Interfacial sliding in Cu/Ta/polyimide high density interconnects as a result of thermal cycling. J. Electron. Mater. 26, 791–797 (1997). https://doi.org/10.1007/s11664-997-0253-y

Download citation

  • Received:

  • Revised:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-997-0253-y

Key words

Search

Navigation