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Influence of Sb on the Performance and Interfacial Behavior of SnBiAg-xSb/Cu Solder Joints

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Abstract

In this work, SnBiAg-xSb solder alloys (where x = 0, 0.5 wt.%, 1.0 wt.%, 1.5 wt.%, 2.0 wt.%, and 2.5 wt.%) were prepared by compression and annealing treatment following water cooling. The microstructure of the SnBiAg-xSb alloy became finer due to the addition of a small amount of Sb. When the Sb content exceeded 1.0 wt.%, the effect of grain refinement decreased, and the grain gradually became coarser with the addition of Sb. As the Sb content increased, the tensile strength of SnBiAg-xSb solder alloys gradually increased while elongation decreased, which was attributed to the solution strengthening of Sb and subsequent microstructural changes. SnBiAg-0.5Sb showed the best elongation at break, reaching a value of 119.12%. Sb increased the starting temperature of the solder during solidification and cooling, expanding the range of the mushy temperature zone. The addition of a small quantity of Sb had a minimal effect on the solder’s wettability. The bonding performance of SnBiAg-xSb solder joints before and after aging was studied, and it was found that SnBiAg-2.0Sb solder joints had the strongest bonding strength.

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Acknowledgments

This study was financially supported by the Science and Technology Major Project of Yunnan Province (202202AB080001), the Young and middle-aged academic and technical leaders reserve talent project (202005AC160039), and the Science and Technology Project of Yunnan Tin Group (Holding) Company Limited (YT-2021-15).

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Authors and Affiliations

  1. Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, 650093, China

    Tinghao Dong, Caiju Li, Guangji Zhou, Peng Gao, Kunxuan Xiao & Jianhong Yi

  2. Yun Tin New Material Co. LTD of Yunnan Tin Group (Holding) Co., Ltd, Kunming, 650501, China

    Lingyan Zhao, Junhu Qin, Jiatao Zhang, Shaoxiong Guo & Qi He

  3. Yunnan Tin Group (Holding) Co, Ltd, Kunming, 650106, China

    Jubo Peng

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  1. Tinghao Dong
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Dong, T., Li, C., Zhou, G. et al. Influence of Sb on the Performance and Interfacial Behavior of SnBiAg-xSb/Cu Solder Joints. J. Electron. Mater. 52, 7979–7990 (2023). https://doi.org/10.1007/s11664-023-10719-w

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