Abstract
One of the most important issues during the selection of low-k dielectrics is related to their intrinsic properties including their electric breakdown and leakage current that are predominantly determined by conduction mechanisms. This study is devoted to elucidating the charge transport mechanism in the SiOCH low-k dielectric films fabricated by plasma-enhanced chemical vapor deposition. By analyzing four bulk-limited models of the charge transport it was found that only the Nasyrov–Gritsenko model of phonon-assisted electron tunneling between neutral traps describes the experimental I–V–T characteristics with all the fitting parameters with reasonable physical values. The obtained thermal trap energy value 1.2 eV is confirmed independently by photoluminescence spectroscopy data analysis. The trap nature and comparison of the obtained results with the corresponding data for low-k films with similar chemical composition and deposited by the spin-on-glass technology using self-assembling chemistry is discussed. It is hypothesized that the defect with ionization energy of 1.2 eV is the oxygen divacancy.
Similar content being viewed by others
References
E.N. Ogawa, O. Aubel, Electrical breakdown in advanced interconnect dielectrics in Advanced Interconnects for ULSI devices. (Wiley, 2012).
A. Grill, J. Vac. Sci. Technol. B 34, 020801 (2016).
O.V. Pedreira, in International Interconnect Technology Conference IITC2021 (Kyoto, Japan, 2021).
C. Adelmann, K. Sankaran, S. Dutta, A. Gupta, J.-P. Soulié, M. Siniscalchi, S. Kundu, M. Mao, V. Founta, N. Jourdan, in ECS Meeting Abstracts (2020), Vol. MA2020-01, pp. 1293.
L. Zhang, J.F. de Marneffe, N. Heylen, G. Murdoch, Z. Tokei, J. Boemmels, S. De Gendt, and M.R. Baklanov, Appl. Phys. Lett. 107, 092901 (2015).
J.M. Atkin, E. Cartier, T.M. Shaw, R.B. Laibowitz, and T.F. Heinz, Appl. Phys. Lett. 93, 122902 (2008).
J.M. Atkin, D. Song, T.M. Shaw, E. Cartier, R.B. Laibowitz, and T.F. Heinz, J. Appl. Phys. 103, 094104 (2008).
E.A. Smirnov, K. Vanstreels, P. Verdonck, I. Ciofi, D. Shamiryan, M.R. Baklanov, and M. Phillips, Jap. J. Appl. Phys. 50, 05EB03 (2011).
S. Shamuilia, V.V. Afanas’ev, P. Somers, A. Stesmans, Y.L. Li, Z. Tokei, G. Groeseneken, and K. Maex, Appl. Phys. Lett. 89, 2009 (2006).
A.A. Gismatulin, V.A. Gritsenko, D.S. Seregin, K.A. Vorotilov, and M.R. Baklanov, Appl. Phys. Lett. 115, 082904 (2019).
T.V. Perevalov, A.A. Gismatulin, A.E. Dolbak, V.A. Gritsenko, E.S. Trofimova, V.A. Pustovarov, D.S. Seregin, K.A. Vorotilov, and M.R. Baklanov, Phys. Status Solidi A 218, 2000654 (2021).
T.V. Perevalov, A.A. Gismatulin, D.S. Seregin, Y. Wang, H. Xu, V.N. Kruchinin, E.V. Spesivtsev, V.A. Gritsenko, K.A. Nasyrov, I.P. Prosvirin, J. Zhang, K.A. Vorotilov, and M.R. Baklanov, J. Appl. Phys. 127, 195105 (2020).
C. Wu, Y. Li, M.R. Baklanov, and K. Croes, ECS J. Solid State Sci. 4, N3065 (2015).
Y. Kayaba, and T. Kikkawa, Jpn. J. Appl. Phys. 47, 5314 (2008).
M.R. Baklanov, L. Zhao, E. Van Besien, and M. Pantouvaki, Microelectron. Eng. 88, 990 (2011).
E. Van Besien, M. Pantouvaki, L. Zhao, D. De Roest, M.R. Baklanov, Z. Tokei, and G. Beyer, Microelectron. Eng. 92, 59 (2012).
K. Vanstreels, I. Ciofi, Y. Barbarin, and M. Baklanov, J. Vac. Sci. Technol. B 31, 050604 (2013).
A.M. Urbanowicz, D. Shamiryan, A. Zaka, P. Verdonck, S. De Gendt, and M.R. Baklanov, J. Electrochem. Soc. 157, H565 (2010).
V. C. Ngwan, C. X. Zhu and A. Krishnamoorthy, in 2004 IEEE International Reliability Physics Symposium Proceedings, 571 (2004).
T. Breuer, U. Kerst, C. Boit, E. Langer, H. Ruelke, and A. Fissel, J. Appl. Phys. 112, 124103 (2012).
V. Jousseaume, A. Zenasni, O. Gourhant, L. Favennec, and M.R. Baklanov, in Advanced Interconnects for ULSI Technology, edited by M. R. Baklanov, P. Ho, and E. Zschech (Wiley, 2012).
V.N. Kruchinin, V.A. Volodin, S.V. Rykhlitskii, V.A. Gritsenko, I.P. Posvirin, S. Xiaoping, and M.R. Baklanov, Opt. Spectrosc. 129, 681 (2021).
J. Frenkel, Phys. Rev. B 54, 647 (1938).
J. Frenkel, Tech. Phys. USSR 5, 685 (1938).
R.M. Hill, Philos. Mag. 23, 59 (1971).
H. Adachi, Y. Shibata, and S. Ono, J. Phys. D: Appl. Phys. 4, 988 (1971).
S.S. Makram-Ebeid, and M. Lannoo, Phys. Rev. B 25, 6406 (1982).
K.A. Nasyrov, and V.A. Gritsenko, J. Appl. Phys. 109, 093705 (2011).
L. Zhao, Z. Tokei, G. G. Gischia, H. Volders, and G. Beyer, in Proceedings of International Interconnect Technology Conference (IEEE, 2009), p. 206.
K.A. Nasyrov, V.A. Gritsenko, Y.N. Novikov, E.H. Lee, S.Y. Yoon, and C.W. Kim, J. Appl. Phys. 96, 4293 (2004).
V.A. Gritsenko, T.V. Perevalov, O.M. Orlov, and G.Y. Krasnikov, Appl. Phys. Lett. 109, 062904 (2016).
V.A. Pustovarov, V.S. Aliev, T.V. Perevalov, V.A. Gritsenko, and A.P. Eliseev, J. Exp. Theor. Phys. 111, 989 (2010).
V.A. Gritsenko, T.V. Perevalov, and D.R. Islamov, Phys. Rep. 613, 1 (2016).
T.V. Perevalov, D.V. Gulyaev, V.S. Aliev, K.S. Zhuravlev, V.A. Gritsenko, and A.P. Yelisseyev, J. Appl. Phys. 116, 244109 (2014).
V.A. Gritsenko, T.V. Perevalov, V.A. Voronkovskii, A.A. Gismatulin, V.N. Kruchinin, V.S. Aliev, V.A. Pustovarov, I.P. Prosvirin, Y. Roizin, and A.C.S. Appl, Mater. Int. 10, 3769 (2018).
L. Skuja, J. Non-Crystalline Solids 239, 16 (1998).
V.S. Kortov, A.F. Zatsepin, S.V. Gorbunov, and A.M. Murzakaev, Phys. Solid State 48, 1273 (2006).
K. Raghavachari, D. Ricci, and G. Pacchioni, J. Chem. Phys. 116, 825 (2002).
L.A. Bakaleinikov, M.V. Zamoryanskaya, E.V. Kolesnikova, V.I. Sokolov, and E.Y. Flegontova, Phys. Solid. State. 46, 1018 (2004).
Y. Ishikawa, A.V. Vasin, J. Salonen, S. Muto, V.S. Lysenko, A.N. Nazarov, N. Shibata, and V.P. Lehto, J. Appl. Phys. 104, 083522 (2008).
Acknowledgments
This work was supported by the Russian Foundation for Basic Research, Grant No. 20-57-12003 (film fabrication, PL and PLE measurements), and under the state contract with ISP SBRAS No. 0242-2021-0003 (electrophysical measurements and simulation). The electrophysical measurements were made on the equipment of CKP "VTAN" in the ATRC department of NSU. The authors thank Dr A.E. Dolbak for technical assistance.
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
Conflict of interest
The authors declare that they have no conflict of interest.
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Perevalov, T.V., Gismatulin, A.A., Gritsenko, V.A. et al. Charge Transport Mechanism in a PECVD Deposited Low-k SiOCH Dielectric. J. Electron. Mater. 51, 2521–2527 (2022). https://doi.org/10.1007/s11664-021-09411-8
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-021-09411-8