Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip Packaging

Chun-Hao Chen; Shih-Wen Hsu; Tung-Han Chuang

doi:10.1007/s11664-020-08523-x

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Last updated: Sat, 6 Mar 2021 9:08:27 GMT

Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip Packaging

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