Abstract
In this paper, the growth of intermetallic compound (IMC) layers is considered. After soldering, an IMC layer appears and establishes a mechanical contact between eutectic tin-silver solder bumps and Cu interconnects in microelectronic components. Intermetallics are relatively brittle in comparison with copper and tin. In addition, IMC formation is typically based on multi-component diffusion, which may include vacancy migration leading to Kirkendall voiding. Consequently, the rate of IMC growth has a strong implication on solder joint reliability. Experiments show that the intermetallic layers grow considerably when the structure is exposed to heat. Mechanical stresses may also affect intermetallic growth behavior. These stresses arise not only from external loadings but also from thermal mismatch of the materials constituting the joint, and from the mismatch produced by the change in shape and volume due to the chemical reactions of IMC formation. This explains why in this paper special attention is being paid to the influence of stresses on the kinetics of the IMC growth. We develop an approach that couples mechanics with the chemical reactions leading to the formation of IMC, based on the thermodynamically sound concept of the chemical affinity tensor, which was recently used in general statements and solutions of mechanochemistry problems. We start with a report of experimental findings regarding the IMC growth at the interface between copper pads and tin based solder alloys in different microchips during a high temperature storage test. Then we analyze the growth kinetics by means of a continuum model. By combining experiment, theory, and a comparison of experimental data and theoretical predictions we finally find the values of the diffusion coefficient and an estimate for the chemical reaction constant. A comparison with literature data is also performed.
Article PDF
Similar content being viewed by others
Avoid common mistakes on your manuscript.
References
L. Lee and A. Mohamad, Adv. Mater. Sci. Eng. 2013, 1 (2013).
S. Fürtauer, D. Li, D. Cupid, and H. Flandorfer, Intermetallics 34, 142 (2013).
W. D. Callister Jr., D. Rethwisch. Material Science and Engineering: An Introduction, 8th ed. Wiley, New York (2010).
O. Liashenko, A. Gusak, and F. Hodaj, J. Mater. Sci.: Mater. Electron. 25, 4664 (2014).
V. Dybkov. Reaction Diffusion and Solid State Chemical Kinetics: Handbook, Trans Tech Publications Ltd, Zurich (2010).
S. Min-Suk, P. Chan-Jin, and K. Hyuk-Sang, Mater. Chem. Phys. 110, 95 (2008).
K. Kim, S. Huh, and K. Suganuma, J. Alloys Compd. 352, 226 (2003).
D. Yu, C. Wu, C. Law, L. Wang, and J. Lai, J. Alloys Compd. 392, 192 (2005).
S. Cogan, S. Know, J. Klein, and R. Rose, J. Mater. Sci. 19, 497 (1984).
N. Dariavach, P. Callahan, J. Liang, and R. Fournelle, J. Electron. Mater. 35, 1581 (2006).
F. Gao, T. Takemoto, H. Nishikawa, and A. Komatsu, J. Electron. Mater. 35, 905 (2006).
H. Gao, F. Wei, Y. Sui, J. Qi, Y. He, and Q. Meng, J. Mater. Sci.: Mater. Electron. 30, 2186 (2019).
Z. Mei, A. Sunwoo, and J. Morris, Mater. Sci. Eng. A 23, 857 (1992).
G. Ross, V. Vuorinen, and M. Paulasto-Kröckel, J. Alloys Compd. 677, 127 (2016).
Y. Arafat, H. Yang, I. Dutta, P. Kumar, and B. Datta, J. Electron. Mater. 49, 3367 (2020).
H. Kim and K. Tu, Phys. Rev. B 53, 16027 (1996).
J. Han, Y. Wang, S. Tan, and F. Guo, J. Electron. Mater. 47, 1705 (2017).
Y. Wang, Y. Wang, L. Ma, J. Han, and F. Guo, J. Electron. Mater. 49, 2159 (2020).
A. Sunwoo, J. Morris, and G. Lucey, Metall. Mater. Trans. A 23, 1323 (1992).
X. Sang, K. Du, and H. Ye, J. Alloys Compd. 469, 129 (2009).
K. Suganuma. Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact (CRC Press, Marcel Dekker, New York, 2003).
M. Schaefer, R. Fournelle, and J. Liang, J. Electron. Mater. 27, 1167 (1998).
D. Yu and L. Wang, J. Alloys Compd. 458, 542 (2008).
A. A. Liu, H. K. Kim, K. N. Tu, and P. A. Totta, J. Appl. Phys. 80, 2774 (1996).
X. Hu and Z. Ke, J. Mater. Sci.: Mater. Electron. 25, 936 (2014).
A. B. Freidin. In Proceedings of the ASME 2013 International Mechanical Engineering Congress and Exposition, p. V009T10A102 (American Society of Mechanical Engineers, 2013).
A. Freidin , E. Vilchevskaya. In: H. Altenbach, A. Öchsner (eds.) Encyclopedia of Continuum Mechanics. Springer, Berlin, pp. 1–17. (2020).
W. H. Müller, E. N. Vilchevskaya, and A. B. Freidin, Lecture Notes of TICMI 16, 3 (2015).
B.-Z. Lee and D. Lee, Acta Mater. 46, 3701 (1998).
S. Bordere, E. Feuillet, J.-L. Diot, R. de Langlade, and J.-F. Silvain, Metall. Mater. Trans B 49, 3343 (2018).
N. Jadhav, E. J. Buchovecky, L. Reinbold, S. Kumar, A. F. Bower, and E. Chason, IEEE Trans. Electron. Packag. Manuf. 33, 183 (2010).
B. H. Chudnovsky. Transmission, Distribution, and Renewable Energy Generation Power Equipment. 2nd ed. (CRC Press, Boca Raton, 2017).
I. Prigogine and R. Defay. Chemical Thermodynamics (Longmans, Green & Co, London, 1954).
P. Glansdorff and I. Prigogine. Thermodynamic Theory of Stability and Fluctuation (Wiley-interscience, New-York, 1971).
M. Grinfeld. Thermodynamic Methods in the Theory of Heterogeneous Systems, Longman Sc & Tech, London (1991).
A. B. Freidin, E. N. Vilchevskaya, and I. Korolev, Int. J. Eng. Sci. 83, 57 (2014).
A. B. Freidin, Mechanics of Solids 50, 260 (2015).
E. J. Lin, Y. K. Tang, Y. C. Hsu, H. W. Tseng, and C. Y. Liu, J. Appl. Phys. 122, 095702 (2017).
M. Xin, W. Fengjiang, Q. Yiyu, and Y. Fusahito, Mater. Lett. 57, 3361 (2003).
A. B. Freidin, I. K. Korolev, S. P. Aleshchenko, and E. N. Vilchevskaya, Int. J. Fract. 202, 245 (2016).
A. Morozov, S. Khakalo, V. Balobanov, A. Freidin, W. Müller, and J. Niiranen, Technische Mechanik 38, 73 (2018).
A. Morozov, A. Freidin, W. H. Müller, T. Hauck, I. Schmadlak. In 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp. 1–10 (2018). https://doi.org/10.1109/EuroSimE.2018.8369860.
P.-F. Yang, Y.-S. Lai, S.-R. Jian, J. Chen, and R. Chen, Mater. Sci. Eng. A 485, 305 (2008).
N. Jiang, J. Clum, R. Chromik, and E. Cotts, Scripta Materialia 37, 1851 (1997).
F. Sun and Z. Yin, J. Mater. Sci: Mater. Electron. 30, 18878 (2009).
L. Huang, W. Jian, B. Lin, Y. Wen, L. Gu, and J. Wang, J. Appl. Phys. 117, 215308 (2015).
M. Sobiech, C. Krüger, U. Welzel, J.-Y. Wang, E. J. Mittemeijer, and W. Hügel, J. Mater. Res. 26, 1482 (2011).
Y. Yuan, G. Yuanyuan, L. Dajan, and M. Nele, J. Alloys Compd. 661, 282 (2015).
M. Onishi and M. Fujibuchi, Trans. Jpn. Inst. Met. 16, 539 (1975).
A. Paul, C. Ghosh, and W. Boettinger, Metall. Mater. Trans. A 42A, 952 (2011).
S. Kumar, C. Handwerker, and M. Dayanada, J. Phase Equilib. Diffus. 32, 309 (2011).
Acknowledgments
The authors appreciate the support of the Russian Science Foundation (Grant No. 19-19-00552).
Funding
Open Access funding provided by Projekt DEAL.
Author information
Authors and Affiliations
Corresponding author
Ethics declarations
Conflict of interest
The authors declare that they have no conflict of interest.
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.
About this article
Cite this article
Morozov, A., Freidin, A.B., Klinkov, V.A. et al. Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects. J. Electron. Mater. 49, 7194–7210 (2020). https://doi.org/10.1007/s11664-020-08433-y
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-020-08433-y