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Influence of Aging Atmosphere on the Thermal Stability of Low-Temperature Rapidly Sintered Cu Nanoparticle Paste Joint

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Abstract

Isothermal aging tests of low-temperature rapidly sintered Cu-Cu joints were conducted at 180°C for 72 h under air and vacuum atmospheres, respectively. Shear strength, micromorphology and elemental analysis of the joints before and after aging were characterized. The experimental results indicated that organics in nano-paste were not capable of sustainably inhibiting the oxidation of Cu nanoparticles under high-temperature and high-oxygen conditions. The shear strength degraded as low as 5.12 MPa after air aging, and a nanoporous and filamentous structure was formed due to the continuous growth of Cu oxides on the surface of the sintered nanoparticles. Nevertheless, the porosity of the as-sintered structure reduced with the formation of a large area interconnection microstructure under low-oxygen aging conditions, thereby the shear strength of the sintered joints notably improved up to 20.03 MPa after vacuum aging.

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Acknowledgments

This research is supported by a Fundamental Research Funds for the Central Universities of China (Grant No. 2018CDGFCL0003).

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Authors and Affiliations

  1. State Key Laboratory of Mechanical Transmission, College of Material Science and Engineering, Chongqing University, Chongqing, 400044, China

    Jiacheng Xie, Jun Shen, Jinzhao Deng & Xu Chen

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  1. Jiacheng Xie
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  2. Jun Shen
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  3. Jinzhao Deng
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  4. Xu Chen
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Correspondence to Jun Shen.

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Xie, J., Shen, J., Deng, J. et al. Influence of Aging Atmosphere on the Thermal Stability of Low-Temperature Rapidly Sintered Cu Nanoparticle Paste Joint. J. Electron. Mater. 49, 2669–2676 (2020). https://doi.org/10.1007/s11664-020-07951-z

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  • DOI: https://doi.org/10.1007/s11664-020-07951-z

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