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High-Frequency Behavior Analysis and Modeling of Silver Plated Printed Circuit Board with Electrochemical Migration

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Abstract

Silver-plated electronic devices are extensively used in microwave circuits. The electrochemical migration of silver in these circuit boards can affect high-frequency characteristics and signal integrity. In this work, the effect of silver migration on signal transmission of printed circuit boards was evaluated using both experimental testing and analytic modeling. The S parameters of circuit boards with silver migration were measured. Based on multi-conductor transmission line theory and electrical properties of dendrite-like electrochemical migrated silver, a distributed parameter circuit model for the circuit board with silver migration was developed. The model results are in good agreement with those obtained from the experimental tests. The results of this investigation provide a better understanding of the high-frequency behavior of a circuit board with silver migration and theoretical support for identifying failure features in fault diagnosis.

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Acknowledgments

This work was supported in part by the National Natural Science Foundations of China (Nos. 51877010, 61674017), in part by Open Fund of State Key Laboratory of Information Photonics and Optical Communication (BUPT), in part by the BUPT Excellent Ph.D. Students Foundation (No. CX2019121), and in part by Auburn University.

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Authors and Affiliations

  1. Beijing Key Laboratory of Work Safety Intelligent Monitoring, School of Electronic Engineering, Beijing University of Posts and Telecommunications, Beijing, 100876, China

    Ziren Wang & Jinchun Gao

  2. Automation School, Beijing University of Posts and Telecommunications, Beijing, 100876, China

    Yilin Zhou

  3. Materials Research and Education Center, Auburn University, Auburn, AL, 36849, USA

    Zhongyang Cheng

Authors
  1. Ziren Wang
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  2. Jinchun Gao
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  3. Yilin Zhou
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  4. Zhongyang Cheng
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Correspondence to Jinchun Gao.

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Wang, Z., Gao, J., Zhou, Y. et al. High-Frequency Behavior Analysis and Modeling of Silver Plated Printed Circuit Board with Electrochemical Migration. J. Electron. Mater. 48, 8039–8046 (2019). https://doi.org/10.1007/s11664-019-07651-3

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  • DOI: https://doi.org/10.1007/s11664-019-07651-3

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