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Thermally Induced Carrier Distribution in a Piezoelectric Semiconductor Fiber

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Abstract

We study the effects of a uniform temperature change on the electromechanical fields associated with the extensional deformation of a piezoelectric semiconductor fiber. The macroscopic theory of thermo-piezoelectric semiconductors is used. Based on the three-dimensional equations, we develop a one-dimensional model for thin piezoelectric semiconductor fibers incorporating thermoelasticity, piezoelectricity, and pyroelectricity. Through a theoretical analysis, it is shown that under a temperature change the carriers in the fiber redistribute themselves under the electric field produced through thermoelastic, pyroelectric and piezoelectric effects. This phenomenon of thermally induced redistribution of charge carriers may be called thermo-piezotronic effect. It suggests the possibility of sensing or transduction between a temperature change and electric currents.

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Acknowledgments

This work was supported by the National Natural Science Foundation of China (Nos. 11672265 and 11621062), the Fundamental Research Funds for the Central Universities (Nos. 2016QNA4026 and 2016XZZX001-05), and the Science and Technology Innovation Committee of Shenzhen (No. JCYJ20180227175523802).

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Authors and Affiliations

  1. Department of Engineering Mechanics, Zhejiang University, Hangzhou, 310027, China

    Ruoran Cheng & Chunli Zhang

  2. Department of Mechanical and Materials Engineering, University of Nebraska-Lincoln, Lincoln, NE, 68588-0526, USA

    Jiashi Yang

  3. Soft Matter Research Center (SMRC), Zhejiang University, Hangzhou, 310027, China

    Chunli Zhang

  4. Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Hangzhou, 310027, China

    Chunli Zhang

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  1. Ruoran Cheng
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  2. Chunli Zhang
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  3. Jiashi Yang
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Correspondence to Chunli Zhang or Jiashi Yang.

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Cheng, R., Zhang, C. & Yang, J. Thermally Induced Carrier Distribution in a Piezoelectric Semiconductor Fiber. J. Electron. Mater. 48, 4939–4946 (2019). https://doi.org/10.1007/s11664-019-07280-w

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  • DOI: https://doi.org/10.1007/s11664-019-07280-w

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