Abstract
The presence of solder flux residues on the printed circuit board assembly surface is an important factor contributing to humidity-related reliability issues that affect device lifetime. This investigation focuses on understanding the hygroscopic nature of typical wave solder flux activators—weak organic acids—under varied temperature conditions. In situ x-ray diffraction measurements assessed the effect of high temperature on the crystal structure of organic activators. The hygroscopicity studies were carried out under relative humidity (RH) levels varying from 30% to ∼ 99% and at temperatures 25°C, 40°C, and 60°C. Water absorption levels were determined using the gravimetric method, and the influence on reliability was assessed using electrochemical impedance and leak current measurements performed on the surface insulation resistance comb patterns. The corrosion studies were correlated with the hygroscopicity results and solubility data. Corrosion morphology was analysed using the optical microscopy and scanning electron microscopy. The results show that the hygroscopic nature of typical solder flux residue depends on its chemical structure and temperature. An increase of temperature shifts the critical RH level for water vapour absorption towards lower RH range, accelerating the formation of a conductive electrolyte and the occurrence of ion transport-induced electrochemical migration. The overall ranking of flux activators with the increasing order of aggressivity is: palmitic < suberic < adipic < succinic < glutaric < dl-malic acid.
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References
H.H. Manko, Solders and Soldering. Materials, Design, Production, and Analysis for Reliable Bonding, 2nd ed. (New York: McGraw-Hill, 1979).
C.J. Tautscher, Contamination Effects on Electronic Products (New York: CRC Press, 1991).
M. Nasta and H.C. Peebles, Circuit World 21, 4 (1995).
J.F. Shipley, Weld. J. 54, 10 (1975).
R. Ambat, M.S. Jellesen, D. Minzari, U. Rathinavelu, M.A.K. Johnsen, P. Westermann, and P. Møller, in Proceedings of the European Corrosion Congress EUROCORR (2009), paper no. 81s1.
K. Piotrowska, M.S. Jellesen, and R. Ambat, Solder. Surf. Mt. Technol. 29, 3 (2017).
M.L. Minges, Electronic Materials Handbook. Volume 1—Packaging, 1st ed. (Almere: ASM International, 1989).
V. Verdingovas, M.S. Jellesen, and R. Ambat, J. Electron. Mater. 44, 4 (2015).
K. Piotrowska, H. Conseil, M.S. Jellesen, and R. Ambat, in Proceedings of the European Corrosion Congress EUROCORR (2014), paper no. 7495.
S. Zhan, M.H. Azarian, and M. Pecht, IEEE Trans. Device Mater. Reliab. 8, 2 (2008).
C. Peng, M.N. Chan, and C.K. Chan, Environ. Sci. Technol. 35, 22 (2001).
M.Z.H. Rozaini, in Atmospheric Aerosols—Regional Characteristics—Chemistry and Physics, ed. by H. Abdul-Razzak (InTech, 2012), pp. 323–346
K.M. Adams, J.E. Anderson, and Y.B. Graves, Circuit World 20, 41 (1994).
L. Van Campen, G.L. Amidon, and G. Zografi, J. Pharm. Sci. 72, 12 (1983).
M.J. Kontny and G. Zografi, J. Pharm. Sci. 74, 2 (1985).
M. Tencer, in 44th Electronic Components and Technology Conference Proceedings (1994), pp. 196–209
L.J. Mauer and M. Allan, Manuf. Confect. 95, 73 (2015).
L.J. Mauer and L.S. Taylor, Pharm. Dev. Technol. 15, 6 (2010).
A.K. Salameh, L.J. Mauer, and L.S. Taylor, J. Food Sci. 71, 1 (2006).
G.W. Warren, P. Wynblatt, and M. Zamanzadeh, J. Electron. Mater. 18, 2 (1989).
J.D. Sinclair, J. Electrochem. Soc. 135, 3 (1988).
S. Zhan, M.H. Azarian, and M.G. Pecht, IEEE Trans. Electron. Packag. Manuf. 29, 3 (2006).
A.N. Hiatt, M.G. Ferruzzi, L.S. Taylor, and L.J. Mauer, J. Agric. Food Chem. 56, 15 (2008).
L.J. Mauer and L.S. Taylor, Annu. Rev. Food Sci. Technol. 1, 1 (2010).
A.H. Al-Muhtaseb, W.A.M. McMinn, and T.R.A. Magee, Food Bioprod. Process. 80, 2 (2002).
L. Treuel, S. Schulze, Th. Leisner, and R. Zellner, Faraday Discuss. 137, 265 (2008).
J.A. Jachim, G.B. Freeman, and L.J. Turbini, IEEE Trans. Components Packag. Manuf. Technol. Part B 20, 4 (1997).
B.A. Smith and L.J. Turbini, J. Electron. Mater. 28, 11 (1999).
C. Dominkovics and G. Harsányi, in 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging (2007), pp. 206–210
L. Zou and C. Hunt, Solder. Surf. Mt. Technol. 11, 2 (1999).
S. Canumalla, K. Ludwig, R. Pedigo, and T. Fitzgerald, in Proceedings—Electronic Components and Technology Conference (2006), pp. 625–632
V. Verdingovas, M.S. Jellesen, and R. Ambat, Solder. Surf. Mt. Technol. 27, 4 (2015).
J.E. Sohn and U. Ray, Circuit World 21, 4 (1995).
Y. Zhou, L.J. Turbini, D. Ramjattan, B. Christian, and M. Pritzker, J. Electron. Mater. 42, 12 (2013).
Toxnet—Toxicology Data Network (U.S. National Library of Medicine). https://toxnet.nlm.nih.gov/
L.M. John and J.W. McBain, J. Am. Oil Chem. Soc. 25, 2 (1948).
I.D. Robb, Aust. J. Chem. 19, 12 (1966).
S.H. Yalkowsky, Y. He, and P. Jain, Handbook of Aqueous Solubility Data, 2nd ed. (Boca Raton: CRC Press, 2010).
V. Verdingovas, M.S. Jellesen, R. Rizzo, H. Conseil, and R. Ambat, in Proceedings of the European Corrosion Congress EUROCORR (2013)
A. Apelblat and E. Manzurola, J. Chem. Thermodyn. 22, 3 (1990).
N.C. Hill and V.P. Kuceski, U.S. Patent 2,824,134 A (1958)
M. Davies and D.M.L. Griffiths, Trans. Faraday Soc. 49, 1405 (1953).
A. Apelblat and E. Manzurola, J. Chem. Thermodyn. 19, 3 (1986).
E.C. Attané and T.F. Doumani, Ind. Eng. Chem. 41, 9 (1949).
A.N. Gaivoronskii and V.A. Granzhan, Russ. J. Appl. Chem. 78, 3 (2005).
W.D. Bancroft and F.J.C. Butler, J. Phys. Chem. 36, 7 (1932).
J.W. Mullin, Kirk-Othmer Encyclopedia of Chemical Technology, Vol. 1, eds. J. Ulrich and T. Stelzer (Hoboken: Wiley, 2001), pp. 1–594.
A. Apelblat and E. Manzurola, J. Chem. Thermodyn. 21, 9 (1989).
C. Marcolli, B. Luo, and T. Peter, J. Phys. Chem. A 108, 12 (2004).
O.D. Kurilenko, Kratkii spravochnik po khimii, 4th ed. (Kiyv: Naukova dumka, 1974).
K. Piotrowska, R. Ud Din, M.S. Jellesen, and R. Ambat, IEEE Trans. Compon. Packag. Manuf. Technol. (2018). https://doi.org/10.1109/tcpmt.2018.2792047.
J.T. Carstensen, Pharmaceutical Principles of Solid Dosage Forms (Lancaster: Technomic Pub, 1993).
L. Ma, B. Sood, and M. Pecht, IEEE Trans. Device Mater. Reliab. 11, 1 (2011).
L.D. Angelo, V. Verdingovas, and L. Ferrero, in Proceedings of the European Corrosion Congress EUROCORR (2016)
H. Zhang, Ch. Xie, Z. Liu, J. Gong, Y. Bao, M. Zhang, H. Hao, B. Hou, and Q. Yin, Ind. Eng. Chem. Res. 52, 51 (2013).
M.Z.H. Rozaini and P. Brimblecombe, Water Air Soil Pollut. 198, 1 (2009).
M. Dupas-Langlet, M. Benali, I. Pezron, K. Saleh, and L. Metlas-Komunjer, J. Food Eng. 115, 3 (2013).
G. Zografi and B. Hancock, Topics in Pharmaceutical Sciences, eds. D.J.A. Crommelin, K.K. Midha, and T. Nagai (Stuttgart: Medpharm Scientific Publishers, 1993), pp. 405–419.
M. Kuwata, W. Shao, R. Lebouteiller, and S.T. Martin, Atmos. Chem. Phys. 12, 12 (2012).
P. Espeau, P. Negrier, and Y. Corvis, Cryst. Growth Des. 13, 2 (2013).
R.A. Lipasek, N. Li, S.J. Schmidt, L.S. Taylor, and L.J. Mauer, J. Agric. Food Chem. 61, 38 (2013).
F.D. Pope, B.J. Dennis-Smither, P.T. Griffiths, S.L. Clegg, and R.A. Cox, J. Phys. Chem. A 114, 16 (2010).
S.T. Martin, Chem. Rev. 100, 9 (2000).
C.W. Harmon, R.L. Grimm, T.M. McIntire, M.D. Peterson, B. Njegic, V.M. Angel, A. Alshawa, J.S. Underwood, D.J. Tobias, R.B. Gerber, M.S. Gordon, J.C. Hemminger, and S.A. Nizkorodov, J. Phys. Chem. B 114, 7 (2010).
J.G. Kapsalis, Water Activity: Theory and Applications to Food (New York: Marcel Dekker Inc, 1987), pp. 173–213.
R.D. Andrade, R. Lemus, and C.E. Perez, Vitae-Revista La Fac. Quim. Farm. 18, 3 (2011).
J. Sun and P.A. Ariya, Atmos. Environ. 45, 5 (2006).
L.J. Turbini, J.A. Jachim, G.B. Freeman, and J.F. Lane, in Proceedings of 1992 13th IEEE/CHMT International Electronic Manufacturing Symposium (1992), pp. 80–84
M. Tencer, Microelectron. Reliab. 48, 4 (2008).
M.N. Chan, S.M. Kreidenweis, and Ch.K. Chan, Environ. Sci. Technol. 42, 10 (2008).
M.T. Parsons, J. Mark, S.R. Lipetz, and A.K. Bertram, J. Geophys. Res. 109, 6 (2004).
P. Saxena and L.M. Hildemann, Environ. Sci. Technol. 31, 11 (1997).
I.R. Zamora, A. Tabazadeh, D.M. Golden, and M.Z. Jacobson, J. Geophys. Res. Atmos. 116, 23 (2011).
M.E. Wise, J.D. Surratt, D.B. Curtis, J.E. Shilling, and M.A. Tolbert, J. Geophys. Res. Atmos. 108, D20 (2003).
S.L. Clegg and J.H. Seinfeld, J. Phys. Chem. A 110, 17 (2006).
C.N. Cruz and S.N. Pandis, Environ. Sci. Technol. 34, 20 (2000).
L. Treuel, S. Pederzani, and R. Zellner, Phys. Chem. Chem. Phys. 11, 36 (2009).
M. Song, C. Marcolli, U.K. Krieger, A. Zuend, and T. Peter, Atmos. Chem. Phys. Discuss. 11, 10 (2011).
A. Apelblat, M. Dov, J. Wisniak, and J. Zabicky, J. Chem. Thermodyn. 27, 1 (1995).
L. Yang, R.T. Pabalan, and M.R. Juckett, J. Solution Chem. 35, 4 (2006).
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Piotrowska, K., Ud Din, R., Grumsen, F.B. et al. Parametric Study of Solder Flux Hygroscopicity: Impact of Weak Organic Acids on Water Layer Formation and Corrosion of Electronics. J. Electron. Mater. 47, 4190–4207 (2018). https://doi.org/10.1007/s11664-018-6311-9
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DOI: https://doi.org/10.1007/s11664-018-6311-9