Abstract
The present work offers both a complete, quantitative model and a conservative acceleration factor expression for the life span of SnAgCu solder joints in thermal cycling. A broad range of thermal cycling experiments, conducted over many years, has revealed a series of systematic trends that are not compatible with common damage functions or constitutive relations. Complementary mechanical testing and systematic studies of the evolution of the microstructure and damage have led to a fundamental understanding of the progression of thermal fatigue and failure. A special experiment was developed to allow the effective deconstruction of conventional thermal cycling experiments and the finalization of our model. According to this model, the evolution of damage and failure in thermal cycling is controlled by a continuous recrystallization process which is dominated by the coalescence and rotation of dislocation cell structures continuously added to during the high-temperature dwell. The dominance of this dynamic recrystallization contribution is not consistent with the common assumption of a correlation between the number of cycles to failure and the total work done on the solder joint in question in each cycle. It is, however, consistent with an apparent dependence on the work done during the high-temperature dwell. Importantly, the onset of this recrystallization is delayed by pinning on the Ag3Sn precipitates until these have coarsened sufficiently, leading to a model with two terms where one tends to dominate in service and the other in accelerated thermal cycling tests. Accumulation of damage under realistic service conditions with varying dwell temperatures and times is also addressed.
Article PDF
Similar content being viewed by others
References
L. Wentlent, L. Yin, M. Meilunas, B. Arfaei, and B. Borgesen, in Proceedings of SMTA International Conference, p. 101, 2011.
P. Borgesen, E. Al-Momani, and M. Meilunas, in Proceedings of SMTA, 2009.
P. Borgesen, J. Jiang, L. Wentlent, M. Meilunas, R. Sivasubramony, L. E. Alvarez, T. Alghoul, and C. Greene, in Proceedings of SMTA International, Rosemont, IL, USA, 2017.
L. Lehman, Y. Xing, T. Bieler, and E. Cotts, Acta Mater. 58, 3546 (2010).
D.W. Henderson, J.J. Woods, T.A. Gosselin, J. Bartelo, D.E. King, T.M. Korhonen, M.A. Korhonen, L.P. Lehman, E.J. Cotts, S.K. Kang, P. Lauro, D.-Y. Shih, C. Goldsmith, and K.J. Puttlitz, J. Mater. Res. 19, 1608 (2004).
S. Terashima, T. Kobayashi, and M. Tanaka, Sci. Technol. Weld. Join. 13, 732 (2008).
S. Terashima, K. Takahama, M. Nozaki, and M. Tanaka, Mater. Trans. 45, 1383 (2004).
U. Telang, R. Bieler, A. Zamiri, and F. Pourboghrat, Acta Mater. 55, 2265 (2007).
J. Sundelin, S. Nurmi, and T. Lepistö, Mater. Sci. Eng. A 474, 201 (2008).
T. Mattila, and J. Kivilahti, IEEE Trans. Compon. Packag. Manuf. Technol. 33, 629 (2010).
A. Qasaimeh, S. Lu, and P. Borgesen, in Components Packaging Manufacturing Technology Conference, 2011.
L. Yin, L. Wentlent, L. Yang, B. Arfaei, A. Qasaimeh, and P. Borgesen, J. Electron. Mater. 41, 241 (2012).
L. Yin, M. Meilunas, B. Arfaei, L. Wentlent, and P. Borgesen, in Proceedings of Electronic Components Technology Conference, 2012.
A. Dasgupta, C. Oman, D. Barker, and M. Petit, AMSE J. Electron. Packag. 114, 152 (1992).
A. Qasaimeh, Y. Jaradat, L. Wentlent, L. Yang, L. Yin, B. Arfaei, and P. Borgesen, in Electronic Components and Technology Conference, pp. 1775–1781, 2011.
A. Schubert, R. Dudek, E. Auerswald, M. Gollbardt, and H. Reichl, Components Packaging Manufacturing Technology Conference, p. 603, 2003.
A. Syed, in Proceedings of Electronic Components and Technology Conference, Las Vegas, NV, USA, USA, 2004.
H. S. Ng, T. Payoh, T. Y. Tee, K. Y. Goh, J. Luan, T. Reinikainen, and A. Kujala, in Proceedings of Components Packaging Manufacturing Technology Conference, Lake Buena Vista, Fl, USA, 2005.
C. Basaran, and C.-Y. Yan, J. Electron. Packag. 120, 379 (1998).
D. Chan, L. Subbarayan, and L. Nguyen, J. Electron. Mater. 41, 398 (2012).
J. Hokka, T.T. Mattila, H. Xu, and M. Paulasto-Krockel, J. Electron. Mater. 42, 963 (2013).
B. Arfaei, S. Mahin-Shirazi, S. Joshi, M. Anselm, P. Borgesen, E. Cotts, J. Wilcox, and R. Coyle, in Proc. Electron. Compon. Technol. Conf., Las Vegas, NV, USA, 2013.
T. Bieler, P. Borgesen, Y. Xing, L. Lehman, and E. Cotts, in Pb-Free and RoHS-Compliant Materials and Processes for Microelectronics, 2007, C.A Handwerker, K. Suganuma, H.L. Reynolds, J. Bath, eds, MRS Spring Meeting.
T.R. Bieler, B. Zhou, L. Blair, A. Zamiri, P. Darbandi, F. Pourboghrat, T.-K. Lee, and K.-C. Liu, J. Electron. Mater. 41, 283 (2012).
B. Arfaei, Y. Xing, J. Woods, J. Wolcott, P. Tumne, P. Borgesen, and E. Cotts, in Proceedings Electronic Components and Technology Conference, 2008.
B. Zhou, T.R. Bieler, T.-K. Lee, and K.-C. Liu, J. Electron. Mater. 39, 2669 (2010).
R.D. Doherty, D.A. Hughes, F.J. Humpreys, J.J. Jonas, D.J. Jensen, M.E. Kassner, W.E. King, T.R. McNelley, H.J. McQueen, and A.D. Rollett, Mater. Sci. Eng. 238, 219 (1997).
R.W. Vook, Acta Met. 12, 197 (1964).
R. Madec, B. Devincre, and L.P. Kubin, Scr. Mater. 47, 689 (2002).
M. Kerr, and N. Chawla, Acta Mater. 52, 4527 (2004).
G. Cuddalorepatta, A. Dasgupta, and K. Holdermann, in Proceedings of IMECE 2008, Boston, MA, 2008.
A. Mayyas, L. Yin, and P. Borgesen, Proc. ASME Int., p. 319, 2009.
A. Qasaimeh, Ph.D. Dissertation, Binghamton University, May 2012.
T. Korhonen, L. Lehman, M. Korhonen, and D. Henderson, J. Electron. Mater. 36, 173 (2007).
P. Borgesen, L. Yang, A. Qasaimeh, L. Yin, and M. Anselm, in Proceedings of SMTA PanPac Conference, 2013.
B. Arfaei, M. Anselm, S. Joshi, S. Mahin-Shirazi, E. Cotts, P. Borgesen, J. Wilcox, and R. Coyle, in Proceedings SMTAI, Rosemont, IL, 2013.
D. Schmitz, S. Shirazi, L. Wentlent, S. Hamasha, L. Yin, A. Qasaimeh, and P. Borgesen, in Proceedings of Components, Packagings Manufacturing Technology, Orlando, FL, USA, 2014.
F.J. Humphreys, and M. Hatherly, Recrystallization and Related Annealing Phenomena (Oxford: Pergamon Press, 1995).
I. Dutta, J. Electron. Mater. 32, 201 (2003).
J. Li, T.T. Mattila, and J.K. Kivilahti, J. Electron. Mater. 39, 77 (2010).
J. Li, H. Xu, T.T. Mattila, J.K. Kivilahti, T. Laurila, and M. Palasto-Krockel, Comput. Mater. Sci. 50, 690 (2010).
A.D. Rollette, and D. Raabe, Comput. Mater. Sci. 21, 69 (2001).
X. Song, and M. Rettenmayr, Mater. Sci. Eng. 332, 153 (2002).
Q. Yu, and S.K. Esche, J. Mater. Process. Technol. 169, 493 (2005).
F.J. Humphreys, and M.G. Ardakani, Acta Mater. 44, 2717 (1996).
S. Shirazi, L. Yin, S. Khasawneh, L. Wentlent, and P. Borgesen, in Proceedings of Components, Packaging, and Manufacturing Technology, San Diego, CA, USA, 2015.
T. Alghoul, D. Watson, N. Adams, S. Khasawneh, F. Batieha, C. Greene, and P. Borgesen, in 66th Electronic Components and Technology Conference, 2016.
P. Borgesen, E. Cotts, and I. Dutta, in SERDP Grant, Project WP-1752, 2015.
H. Song, J. Morris, and F. Hua, JOM 54, 30 (2002).
P. Kumar, Z. Huang, S. Chavali, D. Chan, I. Dutta, G. Subbarayan, and V. Gupta, IEEE Trans. Compon. Packag. Manuf. Technol. 2, 256 (2012).
M. Motalab, Z. Cai, S. P., and P. Lall, in 13th IEEE Intersociety Conference on Thermal Thermomechanical Phenom Electronics System, San Diego, CA, USA, 2012.
S. Wiese, F. Feustel, and E. Meusel, Sens. Actuators A 99, 188 (2002).
M. Amagai, M. Watanabe, M. Omiya, K. Kishimoto, and T. Shibuya, Microelectron. Reliab. 42, 951 (2002).
M. Pei, and J. Qu, in Proc. Int. Symp. Adv. Packag. Mater.: Processes, Prop. Interfaces, Irvine, CA, USA, USA, pp. 45–49, 2005.
H. Ng, T. Tee, K. Goh, J. Luan, T. Reinikainen, E. Hussa, and A. Kujala, in Proceedings of Components Packaging Manufacturing Technology, Lake Buena Vista, FL, USA, 2005.
M.D. Mathew, H. Yang, S. Movva, and K.L. Murty, Metall. Mater. Trans. 36, 99 (2005).
I. Dutta, C. Park, and S. Choi, Mater. Sci. Eng. 379, 401 (2004).
A.S. Argon, Scr. Metall. 4, 1001 (1970).
P. Borgesen, S. Hamasha, L. Wentlent, D. Watson, and C. Greene, in Proceedings of SMTA PanPac Conference, Big Island, HI, USA, 2016.
S. Joshi, B. Arfaei, A. Singh, M. Gharaibeh, M. Obaidat, A. Alazzam, M. Meilunas, L. Yin, M. Anselm, and P. Borgesen, in Proceedings of SMTAI, Rosemont, IL, 2012.
E.A. Brandes, Smithells Metals Reference Book, 7th ed. (London: Butterworth, 1992).
U. Sahaym, B. Talebanpour, I. Dutta, P. Kumar, and P. Borgesen, IEEE Trans. Compon. Packag. Manuf. Technol. 3, 1868 (2013).
S. Hamasha, A. Qasaimeh, Y. Jaradat, and P. Borgesen, IEEE Trans. Compon. Packag. Manuf. Technol. 5, 1292 (2015).
A. Qasaimeh, S. Hamasha, Y. Jaradat, and P. Borgesen, J. Electron. Packag. 137, 021012 (2015).
F. Batieha, S. Hamasha, Y. Jaradat, L. Wentlent, A. Qasaimeh, and P. Borgesen, in Electronic Components and Technology Conference, 2015.
P. Borgesen, S. Hamasha, M. Obaidat, V. Raghavan, X. Dai, M. Meilunas, and M. Anselm, Microelectron. Reliab. 53, 1587 (2013).
Q. Zhou, B. Zhou, T.-K. Lee, and T. Bieler, J. Electron. Mater. 45, 3013 (2016).
B. Zhou, T. Bieler, T.-K. Lee, and W. Liu, J. Electron. Mater. 42, 319 (2013).
B. Zhou, Q. Zhou, T. Bieler, and T.-K. Lee, J. Electron. Mater. 44, 895 (2015).
P. Borgesen, L. Yang, B. Arfaei, L. Yin, B. Roggeman, and M. Meilunas, in SMTA Proceedings of Technology Program - Pan Pacific Microelectronics Symposium, 2011.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Borgesen, P., Wentlent, L., Hamasha, S. et al. A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints. J. Electron. Mater. 47, 2526–2544 (2018). https://doi.org/10.1007/s11664-018-6121-0
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-018-6121-0