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Effect of Rare Earth Metals on the Properties of Zn-20Sn High-Temperature Lead-Free Solder

Abstract

Cerium–lanthanum mixed rare earth (RE) (0.5 wt.%) was added to Zn-20Sn high-temperature lead-free solder to study the effect of RE on the solder properties. The Zn-20Sn-0.5RE solder has a better corrosion resistance than that of Zn-20Sn alloy. RE addition increases the γ-Cu5Zn8 layer thickness, promotes growth of a ε-CuZn5 layer shaped like bamboo shoots, and increases the roughness of the ε-CuZn5 layer, which increases the shear strength of the solder joints. Compared with the Zn-20Sn alloy, the creep resistance of the Zn-20Sn-0.5RE solder was improved after soldering. The indentation hardness increases in an order of Zn-20Sn-0.5RE solder, Zn-20Sn solder, ε-CuZn5 layer, and γ-Cu5Zn8 layer.

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Acknowledgments

This work was supported by the scientific and technological project in Fujian Province (2015H0008).

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Correspondence to Pinqiang Dai.

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Tian, J., Hong, C., Hong, L. et al. Effect of Rare Earth Metals on the Properties of Zn-20Sn High-Temperature Lead-Free Solder. J. Electron. Mater. 48, 2685–2690 (2019). https://doi.org/10.1007/s11664-018-06917-6

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  • DOI: https://doi.org/10.1007/s11664-018-06917-6

Keywords

  • Zn-20Sn alloy
  • high-temperature lead-free solder
  • corrosion resistance
  • interfacial reaction
  • shear strength
  • nano-indentation