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Electron Device Subjected to Temperature Cycling: Predicted Time-to-Failure

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Abstract

The Boltzmann–Arrhenius–Zhurkov constitutive equation is employed to assess the fatigue lifetime of a solder material subjected, during failure-oriented-accelerated-testing (FOAT), to temperature cycling and experiencing plastic deformations (low cycle fatigue condition). The damage caused by a single cycle is quantified, in accordance with Hall’s concept, by the hysteresis loop area of the inelastic strain energy. The suggested methodology is illustrated by a numerical example. It is shown how the operational lifetime of the material can be predicted from the FOAT data.

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References

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Acknowledgments

Part of the research described in this publication is being conducted at the Jet Propulsion Laboratory, California Institute of Technology, under a contract with the National Aeronautics and Space Administration. Copyright 2018. California Institute of Technology. U.S. Government sponsorship acknowledged. Reza Ghaffarian would like to acknowledge support of the program managers of the National Aeronautics and Space Administration Electronics Parts and Packaging (NEPP) Program for their continuous support and encouragement

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Correspondence to Ephraim Suhir.

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Suhir, E., Ghaffarian, R. Electron Device Subjected to Temperature Cycling: Predicted Time-to-Failure. J. Electron. Mater. 48, 778–779 (2019). https://doi.org/10.1007/s11664-018-06867-z

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  • DOI: https://doi.org/10.1007/s11664-018-06867-z

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