Abstract
Investigations of the effects of back-barrier introduction on the two-dimensional electron gas (2DEG) of ultrathin-barrier AlN/GaN heterostructures with AlGaN and InGaN back-barriers are carried out using self-consistent solutions of 1-dimensional Schrödinger–Poisson equations. Inserted AlGaN and InGaN back-barriers are used to provide a good 2DEG confinement thanks to raising the conduction band edge of GaN buffer with respect to GaN channel layer. Therefore, in this paper the influence of these back-barrier layers on sheet carrier density, 2DEG confinement, and mobility are systematically and comparatively investigated. As a result of calculations, although sheet carrier density is found to decrease with InGaN back-barrier layer, it is not changed with AlGaN back-barrier layer for suggested optimise heterostructures. Obtained results can give some insights for further experimental studies.
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B. Gelmont, K. Kim, and M. Shur, J. Appl. Phys. 74, 1818 (1993).
F. Medjdoub, J.-F. Carlin, M. Gonschorek, E. Feltin, M.A. Py, D. Ducatteau, C. Gaquière, N. Grandjean, and E. Kohn, in International Electron Devices Meeting (IEDM), (2006), pp. 1–4.
K. Shinohara, D.C. Regan, Y. Tang, A.L. Corrion, D.F. Brown, J.C. Wong, J.F. Robinson, H.H. Fung, A. Schmitz, and T.C. Oh, I.E.E.E. Trans Electron Devices 60, 2982 (2013).
R. Gaska, J.W. Yang, A. Osinsky, Q. Chen, M.A. Khan, A.O. Orlov, G.L. Snider, and M.S. Shur, Appl. Phys. Lett. 72, 707 (1998).
E. Bahat-Treidel, O. Hilt, F. Brunner, J. Wurfl, and G. Trankle, IEEE Trans. Electron Devices 55, 3354 (2008).
T. Palacios, A. Chakrabort, S. Heikman, S. Keller, S.P. DenBaars, and U.K. Mishra, IEEE Electron Device Lett. 27, 13 (2006).
F. Medjdoub, M. Zegaoui, B. Grimbert, N. Rolland, and P.-A. Rolland, Appl. Phys. Exp. 4, 124101 (2011).
O. Ambacher, B. Foutz, J. Smart, J.R. Shealy, N.G. Weimann, K. Chu, M. Murphy, A.J. Sierakowski, W.J. Schaff, L.F. Eastman, R. Dimitrov, A. Mitchell, and M. Stutzmann, J. Appl. Phys. 87, 334 (2000).
A. Dadgar, F. Schulze, J. Blasing, A. Diez, A. Krost, M. Neuburger, E. Kohn, I. Daumiller, and M. Kunze, Appl. Phys. Lett. 85, 5400 (2004).
Y. Cao and D. Jena, Appl. Phys. Lett. 90, 182112 (2007).
A.M. Dabiran, A.M. Wowchak, A. Osinsky, J. Xie, B. Hertog, B. Cui, D.C. Look, and P.P. Chow, Appl. Phys. Lett. 93, 082111 (2008).
F. Medjdoub, M. Zegaoui, N. Rolland, and P.A. Rolland, Appl. Phys. Lett. 98, 223502 (2011).
I.P. Smorchkova, L. Chen, T. Mates, L. Shen, S. Heikman, B. Moran, S. Keller, S.P. DenBaars, J.S. Speck, and U.K. Mishra, J. Appl. Phys. 90, 5196 (2001).
F. Medjdoub, M. Zegaoui, A. Linge, B. Grimbert, R. Silvestri, M. Meneghini, G. Meneghesso, and E. Zanoni, Solid State Electron. 113, 49 (2015).
D.S. Lee, X. Gao, S. Guo, and T. Palacios, IEEE Electron Device Lett. 32, 617 (2011).
D.S. Lee, X. Gao, S. Guo, D. Kopp, P. Fay, and T. Palacios, IEEE Electron Device Lett. 32, 1525 (2011).
S. Rennesson, B. Damilano, P. Vennegues, S. Chenot, and Y. Cordier, Phys. Status Solidi A 210, 480 (2013).
A. Kamath, T. Patil, R. Adari, I. Bhattacharya, S. Ganguly, R.W. Aldhaheri, M.A. Hussain, and D. Saha, IEEE Electron Device Lett. 33, 1690 (2012).
X. Kong, K. Wei, G. Liu, X. Liu, C. Wang, and X. Wang, Appl. Phys. Exp. 6, 051201 (2013).
L. Wang, W.D. Hu, X.S. Chen, and W. Lu, J. Appl. Phys. 108, 054501 (2010).
M. Auf der Maur, G. Penazzi, G. Romano, F. Sacconi, A. Pecchia, and A. Di Carlo, IEEE Trans. Electron Devices 58, 1425 (2011).
M. Auf der Maur, M. Povolotskyi, F. Sacconi, A. Pecchia, G. Romano, G. Penazzi, and A. Di Carlo, Opt. Quant. Electron 40, 1077 (2008).
M. Povolotskyi and A. Di Carlo, J. Appl. Phys. 100, 063514 (2006).
K.S. Lee, D.H. Yoon, S.B. Bae, M.R. Park, and G.H. Kim, ETRI J. 24, 270 (2002).
I. Vurgaftman and J.R. Meyer, J. Appl. Phys. 94, 3675 (2003).
F. Bernardini, V. Fiorentini, and D. Vanderbilt, Phys. Rev. B 56, R10024 (1997).
A.F. Wright, J. Appl. Phys. 82, 2833 (1997).
A. Polian, M. Grimsditch, and I. Grzegory, J. Appl. Phys. 79, 3343 (1996).
O. Ambacher, J. Majewski, C. Miskys, A. Link, M. Hermann, M. Eickhoff, M. Stutzmann, F. Bernardini, V. Fiorentini, V. Tilak, B. Schaff, and L.F. Eastman, J. Phys. Condens. Matter. 14, 3399 (2002).
S.L. Chuang and C. Chang, Phys. Rev. B Condens. Matter. 54, 2491 (1996).
F. Sacconi, M.A. Maur, and A.D. Carlo, IEEE Trans. Electron Devices 59, 2979 (2012).
N. Okamoto, K. Hoshino, N. Hara, M. Takikawa, and Y. Arakawa, J. Cryst. Growth 272, 278 (2004).
K.H. Lee, P.C. Chang, S.J. Chang, Y.K. Su, and C.L. Yu, Appl. Phys. Lett. 96, 212105 (2007).
K. Elibol, G. Atmaca, P. Tasli, and S.B. Lisesivdin, Solid State Commun. 162, 8 (2013).
G. Atmaca, P. Narin, S.B. Lisesivdin, M. Kasap, and B. Sarikavak-Lisesivdin, Philos. Mag. 95, 79 (2015).
S.B. Lisesivdin and E. Ozbay, Optoelectron. Adv. Mater. Rap. Comm. 3, 904 (2009).
B. Sarikavak-Lisesivdin, Philos. Mag. 93, 1 (2013).
S.B. Lisesivdin, S. Acar, M. Kasap, S. Ozcelik, S. Gokden, and E. Ozbay, Semicond. Sci. Technol. 22, 543 (2007).
G.Y. Zhang, Y.Z. Tong, Z.J. Yang, S.X. Jin, J. Li, and Z.Z. Gan, Appl. Phys. Lett. 71, 3376 (1997).
S. Gokden, Phys. Status Solidi A 2, 369 (2003).
S. Gokden, A. Ilgaz, N. Balkan, and S. Mazzucato, Phys. E Low Dimens. Syst. Nanostruct. 25, 86 (2004).
H. Bach and D. Krause, Thin Films on Glass (Berlin: Springer, 2003), p. 153.
Y. Zhang, X. Zhou, S. Xu, J. Zhang, J. Zhang, and Y. Hao, Appl. Phys. Exp. 6, 061003 (2016).
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All Abbas, J.M., Atmaca, G., Narin, P. et al. A Comparative Study of AlGaN and InGaN Back-Barriers in Ultrathin-Barrier AlN/GaN Heterostructures. J. Electron. Mater. 46, 5278–5286 (2017). https://doi.org/10.1007/s11664-017-5540-7
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DOI: https://doi.org/10.1007/s11664-017-5540-7