Abstract
Palladium-coated copper wire with flash gold (PCA) is a fine wire with an oxidation resistance layer. A new sulfidation test has been assessed in this work, confirming that PCA wires show better sulfidation corrosion resistance than either palladium-coated or bare copper wires. The sulfided surface of PCA was analyzed, along with its bonding strength and electrical properties. The metallurgic mechanism for formation of free air balls during the electric flame-off (EFO) process was identified. The flash gold layer of PCA wires can improve certain shortcomings, including: (1) efficiently promoting sulfidation corrosion resistance, (2) solving the problem of palladium segregation during the EFO process, (3) reducing the starting voltage, and (4) stabilizing the electrical resistivity of the bonding interface.
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References
G.G. Harman, Wire Bonding in Microelectronics Materials, Processes, Reliability, and Yield, 2nd ed. (New York: McGraw-Hill, 1997), p. 1.
L.T. Nguyen, D. McDonald, A.R. Danker, and P. Ng, IEEE Trans. Compon. Packag. Manuf. Technol. Part A 18, 423 (1995).
S. Kaimor, T. Nonaka, and A. Mizoguchi, IEEE Trans. Adv. Packag. 29, 227 (2006).
J. Kam, H. Meng, D. Stephan, D. Calipito, K. Dittmer, and L. Jamin, in Proceedings of the SEMICON Singapore (2007), p. 49.
N. Srikanth, S. Murali, Y.W. Wong, and C.J. Vath III, Thin Solid Films 462, 339 (2004).
S. Murali, N. Srikanth, and C.J. Vath III, Mater. Charact. 50, 39 (2003).
G.G. Harman and J. Albers, IEEE Trans. Parts Hybrids Packag. 13, 406 (1977).
Y.W. Lin, R.Y. Wang, W.B. Ke, I.S. Wang, Y.T. Chiu, K.C. Lu, K.L. Lin, and Y.S. Lai, Mater. Sci. Eng. 543, 152 (2012).
G.C. Leong and H. Uda, PLoS ONE 8, e78705 (2013).
T. Uno, Microelectron. Reliab. 51, 88 (2011).
I.T. Huang, F.Y. Hung, T.S. Lui, L.H. Chen, and H.W. Hsueh, Microelectron. Reliab. 51, 25 (2011).
G.G. Harman, Wire Bonding in Microelectronics, 3rd ed. (New York: McGraw-Hill, 2010).
H.W. Hsueh, F.Y. Hung, T.S. Lui, and L.H. Chen, Microelectron. Reliab. 51, 1159 (2013).
W.J. Van Ooij, Surf. Technol. 6, 1 (1977).
G.W. Kammlott, J.P. Franey, and T.E. Graede, J. Electrochem. Soc. 131, 505 (1984).
D.P. Field, B.W. True, T.M. Lillo, and J.E. Flinn, Mater. Sci. Eng. A 372, 173 (2004).
I.M. Kohen, L.J. Huang, and P.S. Ayyaswamy, Int. J. Heat Mass Transf. 38, 1647 (1995).
Zhang B, Qian K, Wang T, Cong Y, Zhao M, Fan X, and Wang J, in International Conference on Electronic Packaging Technology and High Density Packaging (IEEE, Aug 10–13, 2009), p. 662. doi:10.1109/ICEPT.2009.5270668.
R.R. Keller, R.H. Geiss, Y.W. Cheng, and D.T. Read, Microstructure Evolution During Electric Current Induced Thermomechanical Fatigue of Interconnects, Materials Reliability Division, National Institute of Standards and Technology, 295 (2005).
T.C. Wei and A.R. Daud, Electron. Packag. 125, 617 (2003).
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Chang, CY., Hung, FY. & Lui, TS. Mechanical and Electrical Properties of Palladium-Coated Copper Wires with Flash Gold. J. Electron. Mater. 46, 4384–4391 (2017). https://doi.org/10.1007/s11664-017-5355-6
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DOI: https://doi.org/10.1007/s11664-017-5355-6