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Analysis and Measurement of Residual Stress in Bridge Membrane MEMS Relays

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Abstract

Microelectromechanical system (MEMS) relays are gradually replacing traditional relays because they are smaller and lighter and consume less power. However, performance parameters of MEMS relays, such as the pull-down voltage, response time, and resonant frequency, often deviate from those originally designed, due to residual stress generated during the fabrication process. We present herein a method to measure this residual stress, based on a metal bridge membrane MEMS relay, with the help of a nanoindenter and the finite-element method (FEM). The testing result lies in a reasonable range, indicating that this simple method is reliable and helpful for MEMS relay optimization.

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Authors and Affiliations

  1. Collaborative Innovation Center for Micro/Nano Fabrication, Device and System, State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument, Tsinghua University, Beijing, 100084, China

    Yong Ruan, Weizhong Wang & Zheng You

  2. School of Engineering, Griffith University, Nathan, Brisbane, 4222, Australia

    Yong Zhu

Authors
  1. Yong Ruan
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  2. Weizhong Wang
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  3. Yong Zhu
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  4. Zheng You
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Correspondence to Yong Ruan or Yong Zhu.

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Ruan, Y., Wang, W., Zhu, Y. et al. Analysis and Measurement of Residual Stress in Bridge Membrane MEMS Relays. J. Electron. Mater. 46, 2494–2500 (2017). https://doi.org/10.1007/s11664-017-5323-1

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  • DOI: https://doi.org/10.1007/s11664-017-5323-1

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