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Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

Journal of Electronic Materials volume 45, pages 6177–6183 (2016)Cite this article

Abstract

The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed circuit board design, a test temperature from room temperature to 80°C was established. High impact shock tests were applied to isothermally pre-conditioned ball-grid array interconnects. Under cyclic shock testing, degradation and improved shock performances were identified associated with test temperature variation and non-solder mask defined and solder-mask defined pad design configuration differences. Different crack propagation paths were observed, induced by the effect of the elevated temperature test conditions and isothermal aging pre-conditions.

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Authors and Affiliations

  1. Mechanical and Materials Engineering, Portland State University, Portland, OR, USA

    Tae-Kyu Lee & Zhiqiang Chen

  2. Center for Electron Microscopy and Nanofabrication, Portland State University, Portland, OR, USA

    Zhiqiang Chen & Greg Baty

  3. Michigan State University, East Lansing, MI, USA

    Thomas R. Bieler

  4. University of Texas, Arlington, TX, USA

    Choong-Un Kim

Authors
  1. Tae-Kyu Lee
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  2. Zhiqiang Chen
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  3. Greg Baty
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  4. Thomas R. Bieler
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  5. Choong-Un Kim
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Correspondence to Tae-Kyu Lee.

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Lee, TK., Chen, Z., Baty, G. et al. Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance. J. Electron. Mater. 45, 6177–6183 (2016). https://doi.org/10.1007/s11664-016-4902-x

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  • DOI: https://doi.org/10.1007/s11664-016-4902-x

Keywords

  • Interconnect
  • mechanical shock
  • high-G
  • high-temperature shock
  • lead-free solder