Improvement in Thermoelectric Properties by Tailoring at In and Te Site in In2Te5
- 105 Downloads
We study the role of substitutions at In and Te site in the thermoelectric behavior of In2Te5. Single crystals with compositions In2(Te1−x Se x )5 (x = 0, 0.05, 0.10) and Fe0.05In1.95(Te0.90Se0.10)5 were prepared using a modified Bridgman–Stockbarger technique. Electrical and thermal transport properties of these single crystals were measured in the temperature range of 6 K to 395 K. A substantial decrease in the thermal conductivity was observed in Fe-substituted samples, attributed to enhanced phonon scattering at point defects. Marked enhancement in the Seebeck coefficient S along with concomitant suppression of the electrical resistivity ρ was observed in Se-substituted single crystals. An overall enhancement of the thermoelectric figure of merit (zT) by a factor of 310 was observed in single-crystal Fe0.05In1.95(Te0.90Se0.10)5 compared with single crystals of the parent material In2Te5.
KeywordsThermoelectric thermal conductivity electrical conductivity Seebeck coefficient figure of merit single crystal
Unable to display preview. Download preview PDF.
The authors would like to acknowledge the Indian Department of Science and Technology for partial support through project IR/S2/PU-10/2006. A.D.T. would like to acknowledge partial support from the Center for Energy and Environment, Indian Institute of Technology Patna (IITP).
- 3.G.S. Nolas, J. Sharp, and H.J. Goldsmid, Thermoelectrics: Basic Principles and New Materials Developments (Springer, New York, 2001).Google Scholar
- 5.T.M. Tritt, M. Kanatzidis, G. Mahan, and H.B. Lyon, Mater. Res. Soc. Symp. Proc. 478 (1997).Google Scholar
- 6.T. Hendricks and W.T. Choate, Engineering Scoping Study of Thermoelectric Generator Systems for Industrial Waste Heat Recovery (US Department of Energy, Pacific Northwest, 2006).Google Scholar
- 7.J. Yang, Proceedings of 24th International Conference on Thermoelectrics, p. 155 (2005).Google Scholar
- 17.A.K. Yadav (Ph.D. thesis, IIT Bombay, 2014).Google Scholar
- 18.C.B. Huang, Y.B. Ni, H.X. Wu, Z.Y. Wang, X.D. Cheng, and R.C. Xiao, J. Inorg. Mater. 29 (2014).Google Scholar
- 19.L.M. Caroline (Ph.D. thesis, Chapter 1, Bharath University, 2010).Google Scholar
- 21.S.O. Kasap, Principles of Electronic Materials and Devices, 3rd ed. (McGraw-Hill, New York, 2005).Google Scholar
- 23.T.M. Tritt, Thermal Conductivity, Theory, Properties and Applications (Kluwer Academic/Plenum, New York, 2004).Google Scholar
- 24.C. Kittel, Introduction to Solid State Physics, 7th ed. (Wiley, New York, 1996).Google Scholar
- 28.I.K. Dimitrov, M.E. Manley, S.M. Shapiro, J. Yang, W. Zhang, L.D. Chen, Q. Jie, G. Ehlers, A. Podlesnyak, J. Camacho, and Qiang Li, Phys. Rev. B 82, 174301 (2010).Google Scholar
- 29.H. Liu, J. Yang, X. Shi, S.A. Danilkin, D. Yu, C. Wang, W. Zhang, and L. Chen, J. Materiomics (2016), http:// dx.doi.org/10.1016/j.jmat.2016.05.006.