Skip to main content
SpringerLink
Log in

Solid Liquid Interdiffusion Bonding of Zn4Sb3 Thermoelectric Material with Cu Electrode

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

The ZnSb intermetallic compound may have thermoelectric applications because it is low in cost and environmentally friendly. In this study, a Zn4Sb3 thermoelectric element coated with a Ni barrier layer and a Ag reaction layer was bonded with a Ag-coated Cu electrode using a Ag/Sn/Ag solid–liquid interdiffusion bonding process. The results indicated that a Ni5Zn21 intermetallic phase formed easily at the Zn4Sb3/Ni interface, leading to sound adhesion. In addition, Sn film was found to react completely with the Ag layer to form a Ag3Sn intermetallic layer having a melting point of 480°C. The resulting Zn4Sb3 thermoelectric module can be applied at the optimized operation temperature (400°C) of Zn4Sb3 material as a thermoelectric element. The bonding strengths ranged from 14.9 MPa to 25.0 MPa, and shear tests revealed that the Zn4Sb3/Cu-joints fractured through the interior of the thermoelectric elements.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. H. Zhang, H.Y. Jing, Y.D. Han, L.Y. Xu, and G.-Q. Lu, J. Alloys Compd. 576, 424 (2013).

    Article  Google Scholar 

  2. Y. Gelbstein, J. Electron. Mater. 40, 533 (2011).

    Article  Google Scholar 

  3. D.B. Xiong, N.L. Okamoto, and H. Inui, Scr. Mater. 69, 397 (2013).

    Article  Google Scholar 

  4. M.I. Fedorov, L.V. Prokofeva, D.A. Pshenay-Severin, A.A. Shabaldin, and P.P. Konstantinov, J. Electron. Mater. 43, 2314 (2014).

    Article  Google Scholar 

  5. T.M. Ritzer, P.G. Lau, and A.D. Bogard, Proceedings of 16th International Conference Thermoelectrics, (Dresden, Germany, August 26–29, 1997), p. 619.

  6. M. Weinstein and A.I. Mlavsky, Rev. Sci. Instrum. 33, 1119 (1962).

    Article  Google Scholar 

  7. H. Xia, F. Drymiotis, C.L. Chen, A. Wu, and G.J. Snyder, J. Mater. Sci. 49, 1716 (2014).

    Article  Google Scholar 

  8. J. Fan, L. Chen, S. Bai, and X. Shi, Mater. Lett. 58, 3876 (2004).

    Article  Google Scholar 

  9. D.G. Zhao, X.Y. Li, L. He, W. Jiang, and L.D. Chen, J. Alloys Compd. 477, 425 (2009).

    Article  Google Scholar 

  10. D.G. Zhao, H. Geng, and X. Teng, J. Alloys Compd. 517, 198 (2012).

    Article  Google Scholar 

  11. C.L. Yang, H.J. Lai, J.D. Hwang, and T.H. Chuang, J. Mater. Eng. Perform. 22, 2029 (2013).

    Article  Google Scholar 

  12. C.L. Yang, H.J. Lai, J.D. Hwang, and T.H. Chuang, J. Electron. Mater. 42, 359 (2013).

    Article  Google Scholar 

  13. T.H. Chuang, H.J. Lin, C.H. Chuang, W.T. Yeh, J.D. Hwang, and H.S. Chu, J. Electron. Mater. 43, 4610 (2014).

    Article  Google Scholar 

  14. T.H. Chuang, W.T. Yeh, C.H. Chuang, and J.D. Hwang, J. Alloys Compd. 613, 46 (2014).

    Article  Google Scholar 

  15. S.W. Chen, C.M. Hsu, C.Y. Chou, and C.W. Hsu, Prog. Nat. Sci. Mater. 21, 386 (2011).

    Article  Google Scholar 

  16. C.Y. Chou, S.W. Chen, and Y.S. Chang, J. Mater. Res. 21, 1849 (2006).

    Article  Google Scholar 

  17. O. Zobac, J. Sopousek, J. Bursik, A. Zemanova, and P. Roupcova, Metall. Mater. Trans. 45A, 1181 (2014).

    Article  Google Scholar 

Download references

Acknowledgements

The authors are grateful for the financial support of this study by the Ministry of Science and Technology, Taiwan, under Grant No. NSC 102-2221-E-002-057-MY3, and by the Industrial Technology Research Institute, under Grant No. 104-S-A28.

Author information

Authors and Affiliations

  1. Institute of Materials Science and Engineering, National Taiwan University, Taipei, 106, Taiwan

    Y. C. Lin, K. T. Lee & T. H. Chuang

  2. Material & Chemical Research Laboratories, Industrial Technology Research Institute, Hsinchu, 31015, Taiwan

    J. D. Hwang, H. S. Chu & C. C. Hsu

  3. Department of Materials Engineering, Ming Chi University of Technology, Taipei, 243, Taiwan

    S. C. Chen

Authors
  1. Y. C. Lin
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. K. T. Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. J. D. Hwang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. H. S. Chu
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. C. C. Hsu
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. S. C. Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

  7. T. H. Chuang
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to T. H. Chuang.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Lin, Y.C., Lee, K.T., Hwang, J.D. et al. Solid Liquid Interdiffusion Bonding of Zn4Sb3 Thermoelectric Material with Cu Electrode. J. Electron. Mater. 45, 4935–4942 (2016). https://doi.org/10.1007/s11664-016-4645-8

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-016-4645-8

Keywords

Search

Navigation