Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength
- 705 Downloads
Although considerable research has been dedicated to the synthesis and characterization of lead-free nanoparticle solder alloys, only very little has been reported on the reliability of the respective joints. In fact, the merit of nanoparticle solders with depressed melting temperatures close to the Sn-Pb eutectic temperature has always been challenged when compared with conventional solder joints, especially in terms of inferior solderability due to the oxide shell commonly present on the nanoparticles, as well as due to compatibility problems with common fluxing agents. Correspondingly, in the current study, Sn-Ag-Cu (SAC) nanoparticle alloys were combined with a proper fluxing vehicle to produce prototype nanosolder pastes. The reliability of the solder joints was successively investigated by means of electron microscopy and mechanical tests. As a result, the optimized condition for employing nanoparticles as a competent nanopaste and a novel procedure for surface treatment of the SAC nanoparticles to diminish the oxide shell prior to soldering are being proposed.
KeywordsNanosolders nanojoints Pb-free solders nanoparticles SAC
- 3.K.J. Puttlitz and K.A. Stalter, Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Marcel Dekker Inc., New York, 2004), p. 239Google Scholar
- 11.Solder Paste Task Group, Requirements for Soldering Pastes “J-STD-005” (Electronic Industries Alliance and IPC, Arlington, VA, 1995)Google Scholar
- 12.J.S. Hwang, Solder Paste in Electronics Packaging, (Springer, New York, 2012), p. 52Google Scholar
- 13.Association Connecting Electronics Industries (IPC), Acceptability of Electronic Assemblies “IPC-A-610” (Bannockburn, IL, 2010)Google Scholar
- 18.M. Pecht, Soldering Processes and Equipment (Wiley, New York, 1993), p. 9.Google Scholar
- 20.A. Roshanghias, A.H. Kokabi, Y. Miyashita, Y. Mutoh, and H.R. Madaah-Hosseini, J. Mater. Sci. 24, 839 (2013).Google Scholar
- 21.P. Zimprich, A. Betzwar-Kotas, G. Khatibi, B. Weiss, and H. Ipser, J. Mater. Sci. 19, 383 (2008).Google Scholar
- 23.J. Emsley, The Elements (Clarendon Press, Oxford, 1989), p. 196.Google Scholar
- 24.R.W. Hertzberg, Deformation and Fracture Mechanics of Engineering Materials, 4th ed. (Wiley, New York, 1996), p.␣11, 22, 45, 233.Google Scholar
- 27.A. Pomogailo and G.I. Dzhardimalieva, Nanostructured Materials Preparation via Condensation Ways (Springer, Dordrecht, 2014), p. 13Google Scholar
Open AccessThis article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.