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Effect of Percolation on Structural and Electrical Properties of MIC Processed SiGe/Al Multilayers

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Abstract

The effect of metal induced crystallization (MIC) is widely used in the production of electronic devices by forming large grained polycrystalline Si from amorphous Si in contact with Al. This effect can also be utilized in conjunction with silicon-germanium (SiGe) alloys and thus provides means of a possible low cost production of future high temperature thermoelectric devices. In this work, sputter deposited multilayer systems of Si80Ge20/Al thin films have been investigated. The effect of MIC is used to crystallize the initially amorphous SiGe while simultaneously doping it with Al. As metallic phases would be detrimental to the thermoelectric performance, special interest is directed to the Al layers and their dissociation during the annealing treatment. A percolation limit regarding the thickness and continuity of the Al layers was found, but no detrimental side effects with respect to the MIC process could be detected.

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References

  1. C.B. Vining, CRC Handbook of Thermoelectrics, ed. D.M. Rowe (Florida: Boca Raton, 1995), p. 329.

    Google Scholar 

  2. A.J. Minnich, M.S. Dresselhaus, Z.F. Ren, and G. Chen, Energy Environ. Sci. 2, 466 (2009).

    Article  Google Scholar 

  3. Y. Lan, A.J. Minnich, G. Chen, and Z.F. Ren, Adv. Funct. Mater. 20, 357 (2010).

    Article  Google Scholar 

  4. G.H. Zhu, H. Lee, Y.C. Lan, X.W. Wang, G. Joshi, D.Z. Wang, J. Yang, D. Vashaee, H. Guilbert, A. Pillitteri, M.S. Dresselhaus, G. Chen, and Z.F. Ren, Phys. Rev. Lett. 102, 196803 (2009).

    Article  Google Scholar 

  5. T.H. Zou, X.Y. Qin, D. Li, B.J. Ren, G.L. Sun, Y.C. Dou, Y.Y. Li, L.L. Li, J. Zhang, and H.X. Xin, J. Appl. Phys. 115, 053710 (2014).

    Article  Google Scholar 

  6. S. Ii, T. Hirota, K. Fujimoto, Y. Sugimoto, N. Takata, K. Ikeda, H. Nakashima, and H. Nakashima, Mater. Trans. 49, 723 (2008).

    Article  Google Scholar 

  7. L.P.H. Jeurgens, Z. Wang, and E.J. Mittemeijer, Int. J. Mater. Res. 100, 1281 (2009).

    Article  Google Scholar 

  8. R. Lechner, M. Buschbeck, M. Gjukic, and M. Stutzmann, Phys. Status Solidi 1, 1131 (2004).

    Article  Google Scholar 

  9. H. Takiguchi, K. Fukui, and Y. Okamoto, Jpn. J. Appl. Phys. 49, 115602 (2010).

    Article  Google Scholar 

  10. M. Kurosawa, N. Kawabata, T. Sadoh, and M. Miyao, ECS J. Solid State Sci. Technol. 1, 144 (2012).

    Article  Google Scholar 

  11. Z.M. Wang, J.Y. Wang, L.P.H. Jeurgens, and E.J. Mittemeijer, Phys. Rev. Lett. 100, 125503 (2008).

    Article  Google Scholar 

  12. T.J. Konno and R. Sinclair, Philos. Mag. B 66, 749 (1992).

    Article  Google Scholar 

  13. J.P. Dismukes, L. Ekstrom, and R.J. Paff, J. Phys. Chem. 68, 3021 (1964).

    Article  Google Scholar 

  14. C.-W. Hwang, M.-K. Ryu, K.-B. Kim, S.-C. Lee, and C.-S. Kim, J. Appl. Phys. 77, 3042 (1995).

    Article  Google Scholar 

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Acknowledgements

Financial support from the German Research Foundation (DFG) within the priority Program SPP 1386 and from the European Commission within the FP-7 Project NanoHiTEC (FP7-263306) is gratefully acknowledged.

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Correspondence to M. Lindorf.

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Lindorf, M., Rohrmann, H., Span, G. et al. Effect of Percolation on Structural and Electrical Properties of MIC Processed SiGe/Al Multilayers. J. Electron. Mater. 45, 1730–1733 (2016). https://doi.org/10.1007/s11664-015-4190-x

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  • DOI: https://doi.org/10.1007/s11664-015-4190-x

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