Advertisement

Journal of Electronic Materials

, Volume 45, Issue 1, pp 245–254 | Cite as

Advanced Materials for High Temperature, High Performance, Wide Bandgap Power Modules

  • Chad B. O’NealEmail author
  • Brad McGee
  • Brice McPherson
  • Jennifer Stabach
  • Richard Lollar
  • Ross Liederbach
  • Brandon Passmore
Article

Abstract

Advanced packaging materials must be utilized to take full advantage of the benefits of the superior electrical and thermal properties of wide bandgap power devices in the development of next generation power electronics systems. In this manuscript, the use of advanced materials for key packaging processes and components in multi-chip power modules will be discussed. For example, to date, there has been significant development in silver sintering paste as a high temperature die attach material replacement for conventional solder-based attach due to the improved thermal and mechanical characteristics as well as lower processing temperatures. In order to evaluate the bond quality and performance of this material, shear strength, thermal characteristics, and void quality for a number of silver sintering paste materials were analyzed as a die attach alternative to solder. In addition, as high voltage wide bandgap devices shift from engineering samples to commercial components, passivation materials become key in preventing premature breakdown in power modules. High temperature, high dielectric strength potting materials were investigated to be used to encapsulate and passivate components internal to a power module. The breakdown voltage up to 30 kV and corresponding leakage current for these materials as a function of temperature is also presented. Lastly, high temperature plastic housing materials are important for not only discrete devices but also for power modules. As the operational temperature of the device and/or ambient temperature increases, the mechanical strength and dielectric properties are dramatically reduced. Therefore, the electrical characteristics such as breakdown voltage and leakage current as a function of temperature for housing materials are presented.

Keywords

Power modules wide bandgap high temperature electronic materials silver sintering paste 

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. 1.
    J. Hornberger, B. McPherson, and B. Passmore, Extreme Environment Electronics, ed. J.D. Cressler and H.A. Mantooth (Boca Raton: CRC Press, 2013), p. 803.Google Scholar
  2. 2.
    M.K. Das, C. Capell, D.E. Grider, S. Leslie, J. Ostop, R. Raju, M. Schutten, J. Nasadoski, and A. Hefner, IEEE ECCE Conference (2011).Google Scholar
  3. 3.
    S.H. Ryu, C. Capell, C. Jonas, M.J. O’Loughlin, J. Clayton, E.V. Brunt, K. Lam, J. Richmond, A. Kadavelugu, S. Bhattacharya, A.A. Burk, A. Agarwal, D. Grider, S.T. Allen, and J.W. Palmour, Materials Science Forum, ed. H. Okumura, H. Harima, T. Kimoto, M. Yoshimoto, H. Watanabe, T. Hatayama, H. Matsuura, T. Funaki, and Y. Sano (Scientific.Net, 2014), p. 1030.Google Scholar
  4. 4.
    D.W. Berning, T.H. Duong, J.M. Ortiz-Rodriguez, A. Rivera-Lopez, and A.R. Hefner, IEEE IAS Conference (2008).Google Scholar
  5. 5.
    C.E. Weitzel, J.W. Palmour, C.H. Carter Jr, K. Moore, K.J. Nordquist, S. Allen, C. Thero, and M. Bhatnagar, IEEE Trans. Electron. Dev. 43, 10 (1996).CrossRefGoogle Scholar
  6. 6.
    M.E. Levinshtein, T.T. Mnatsakanov, P.A. Ivanov, J.W. Palmour, S.L. Rumyantsev, R. Singh, and S.N. Yurkov, Electron. Lett. 36, 14 (2000).CrossRefGoogle Scholar
  7. 7.
    R.F. Davis, G. Kelner, M. Shur, J.W. Palmour, and J.A. Edmond, Proc. IEEE 79, 5 (1991).Google Scholar
  8. 8.
    H.A. Mantooth, Extreme Environment Electronics, ed. J.D. Cressler and H.A. Mantooth (Boca Raton: CRC Press, 2013), p. 243.Google Scholar
  9. 9.
    F. Yu, R.W. Johnson, and M. Hamilton, IMAPS HiTEC Conference (2014).Google Scholar
  10. 10.
    D.J. DeVoto, P.P. Paret, and A.A. Wereszczak, IMAPS HiTEC Conference (2014).Google Scholar
  11. 11.
    C. Buttay, A. Masson, J. Li, M. Johnson, M. Lazar, C. Raynaud, and H. Morel, IMAPS HiTEN Conference (2011).Google Scholar

Copyright information

© The Minerals, Metals & Materials Society 2015

Authors and Affiliations

  1. 1.Wolfspeed, A Cree CompanyFayettevilleUSA

Personalised recommendations