Metal Gate (TiN, TiC, TaN) Film Stack Stress

Abstract

Successful stress engineering in semiconductor device structures must consider all the contributions to the stress field including those not typically considered for stress, such as work function metal (WFM) gate layers that are used to tune to the desired work function level. These films induce stress especially since they are so close to the channel region. In this study we measure stress from blanket layer films and combinations of TiN, TiC, and TaN deposited on Hf oxide, at thicknesses that are typically used for advanced metal–oxide–semiconductor field-effect transistor (MOSFET) devices. Tungsten (W) deposited on top of the WFM layer stacks is also measured. For combination film stacks, the stress is measured after each deposition step. The induced stress from the WFM is significant, in the range of hundreds of MPa, and varies according to the thickness and processing conditions such as annealing temperature and time, etc. Results from these blanket film measurements were used as a guide for technology computer-aided design (TCAD) modeling of the stress field in FinFET structures with design rules comparable to 10-nm technology. The tensor stress components identify areas of compressive and tensile stress and with a magnitude similar to expected results. The stress field could be used to calculate the FinFET device performance, and in this case an example is provided with the relative improvement in drain current.